NIS3001A
Integrated Driver and
MOSFET Power Chip for
Synchronous Buck
Controllers
The NIS3001A is an integrated multi−chip solution for high power
DC to DC synchronous buck converters. It contains two power
MOSFETs that are controlled by an internal Driver. All three die are
packaged in a power QFN package called PInPAK . The
10.5 by 10.5 mm PInPAK package increases power density and
simplifies PCB layout. The device can be used in single or
multi−phase applications.
The NIS3001A implements the newest MOSFET technology. The
control MOSFET is designed to provide improved switching
performance and operates at a much lower temperature compared to
discrete solutions. The synchronous MOSFET is designed to reduce
conduction and switching losses at high frequencies. The integrated
solution greatly reduces the parasitic inductance associated with
conventional discrete buck converters and results in the highest
power conversion efficiency.
http://onsemi.com
MARKING
DIAGRAM
NIS3001A
CASE 500
PInPAK
AWLYYWW
10.5x10.5 PLLP
A
= Assembly Site
WL = Wafer Lot
YY = Year
WW = Work Week
The power density of the NIS3001A is optimized based on
MOSFET die size and PInPAK design. The PInPAK layout allows for
direct routing into each power terminal. This results in a better
thermal solution for the system. In addition its thermal resistance is
50% lower than BGAs. In summary, the NIS3001A has an improved
efficiency, reliability and scalability for multi−phase synchronous
buck converters.
PINOUT DIAGRAM
14 15 16 17
11 12
13
1
2
3
4
18
19
20
21
10
9
7
8
Features
5
• Matched MOSFETs for Optimal Efficiency
• 10.5 mm x 10.5 mm PInPAK Package
• 31 A DC Output Current
6
• 7.0 to 14 V Input Voltage Range
• Internal Thermal Shutdown
(Bottom View)
• Operating Frequency Range up to 1,000 kHz
• 0.7 V to 5.1 V Output Voltage Range
• Nominal Duty Cycle 5 to 50%
ORDERING INFORMATION
†
Device
Package
Shipping
NIS3001AQPT1
PInPAK
1500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Hi Side
VIN
Discrete
FETs
Analog
Driver
IC
DRN
VS
Lo Side
Discrete
FETs
PGND
Figure 1.
Semiconductor Components Industries, LLC, 2003
1
Publication Order Number:
October, 2003 − Rev. 1
NIS3001A/D