Intel® PXA270 Processor
Electrical, Mechanical, and Thermal Specification
Data Sheet
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High-performance processor:
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Low power:
—Intel XScale® microarchitecture with
Intel® Wireless MMX™ Technology
—Wireless Intel Speedstep® Technology
—Less than 500 mW typical internal
dissipation
—7 Stage pipeline
—32 KB instruction cache
—32 KB data cache
—Supply voltage may be reduced to
0.85 V
—Four low-power modes
—2 KB “mini” data cache
—Extensive data buffering
—Dynamic voltage and frequency
management
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256 Kbytes of internal SRAM for high
speed code or data storage preserved
during low-power states
High-speed baseband processor interface
(Mobile Scalable Link)
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High-performance memory controller:
—Four banks of SDRAM: up to 104 MHz
@ 2.5V, 3.0V, and 3.3V I/O interface
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—Six static chip selects
Rich serial peripheral set:
—AC’97 audio port
—Support for PCMCIA and Compact
Flash
—I2S audio port
—Companion chip interface
Flexible clocking:
—CPU clock from 104 to 624 MHz
—Flexible memory clock ratios
—Frequency changes
—USB Client controller
—USB Host controller
—USB On-The-Go controller
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—Three high-speed UARTs (two with
hardware flow control)
—Functional clock gating
—FIR and SIR infrared communications
port
Additional peripherals for system
connectivity:
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Hardware debug features — IEEE JTAG
interface with boundary scan
Hardware performance-monitoring
features with on-chip trace buffer
Real-time clock
Operating-system timers
LCD Controller
—SD Card / MMC Controller (with SPI
mode support)
—Memory Stick card controller
—Three SSP controllers
—Two I2C controllers
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—Four pulse-width modulators (PWMs)
—Keypad interface with both direct and
matrix keys support
Universal Subscriber Identity Module
interface
—Most peripheral pins double as GPIOs
Order Number 280002-002