Datasheet > MTC40F204WS1RC56B

MTC40F204WS1RC56B

更新时间： 2024-03-03 10:07:50

品牌	Logo	应用领域
镁光 - MICRON		/
页数	文件大小	规格书
8页	281K
描述
This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

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MTC40F204WS1RC56B 数据手册

TN-00-01: Moisture Absorption

Device Baking

If the seal on the shipping container has been broken or if the devices have been

removed from their shipping containers and exposed to high levels of moisture, Micron

recommends a device bake-out procedure before surface mounting.

Devices not stored in sealed moisture barrier bags require baking before mounting if any

one of the following statements is true:

1. Devices have been stored at >20% RH.

2. The humidity indicator card is >20% RH when read at 23°C (+5°C).

3. The product floor life has expired (specified on the packaging label).

Table 2 outlines the bake-out requirements specified in IPC/JEDEC standard J-STD-033

(see the latest revision) and recommended by Micron. These are listed by package thick-

ness and moisture sensitivity level. Devices may be baked at 125°C for high-temperature

device containers. Additional bake-out conditions are provided in Table 2 for cases

where the device containers cannot be subjected to high temperature, or shorter bake

times are desired.

In the cases of mNAND and SSD products, baking is not allowed on units already

programmed at customer side. In the cases where a bake is needed on units already

programmed, the units must be reprogrammed after baking.

PDF: CCMTD-1725822587-6205/Source: CCM005-524338224-10529

TN0001.fm - Rev. J 8/23 EN

Micron Technology, Inc., reserves the right to change products or specifications without notice.

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