Datasheet > MTC40F204WS1RC56B

MTC40F204WS1RC56B

更新时间： 2024-03-03 10:07:50

品牌	Logo	应用领域
镁光 - MICRON		/
页数	文件大小	规格书
8页	281K
描述
This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

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MTC40F204WS1RC56B 数据手册

TN-00-01: Moisture Absorption

Absorption Characteristics

Micron’s extensive testing empirically characterizes the moisture absorption character-

istics of plastic packages. As the plastic takes on moisture, the weight of the device

increases. Micron employs a standard procedure for weighing the device before and

after it is exposed to moisture. We calculate the percentage of weight gain to determine

the relative efficiency of different packaging techniques used for shipping devices.

Shelf Life Requirements

Micron has reduced the chance of having popcorn failures with surface-mount packages

by shipping all material that is not level one (as defined in Table 1 on page 4) in sealed

moisture barrier bags containing a desiccant. Devices stored in these bags show no

measurable weight gain when subjected to a high-humidity environment for extended

periods. Hence, devices stored in unopened, sealed bags at lower than 40°C and 90% RH

have a shelf life of 36 months. Before shipping product, Micron will ensure that the

package seal date is within the 36 month window. If not, the product will be backed out

of finished goods and the condition of the humidity indicator card (HIC) will be

inspected. If the HIC indicates an elevated level of moisture, the parts will be baked dry,

repackaged with a new moisture barrier bag, desiccant, and HIC. The package seal date

on the label will be updated accordingly. If the HIC does not indicate an elevated level of

moisture, the parts will be repackaged as above without the baking step. The date code

on the product will not change, but the customer can be assured that the product shelf

life with respect to moisture absorption extends to 36 months from the package seal

date. Electrical functionality of the devices is not affected by the extended storage times.

Moisture absorption can be eliminated by storing the devices at the recommended floor

life conditions specified in Table 1.

There is no shelf life for module-level products. The memory components are humidity

sensitive, which can affect their performance and reliability during mounting. When

mounted, these components are no longer moisture sensitive.

PDF: CCMTD-1725822587-6205/Source: CCM005-524338224-10529

TN0001.fm - Rev. J 8/23 EN

Micron Technology, Inc., reserves the right to change products or specifications without notice.

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