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MSM7582 PDF预览

MSM7582

更新时间: 2024-01-11 22:42:12
品牌 Logo 应用领域
冲电气 - OKI 调制解调器
页数 文件大小 规格书
24页 180K
描述
pie/4 Shift QPSK MODEM

MSM7582 技术参数

生命周期:Obsolete零件包装代码:TSOP1
包装说明:TSOP1,针数:32
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.84数据速率:384 Mbps
JESD-30 代码:R-PDSO-G32长度:12.4 mm
功能数量:1端子数量:32
最高工作温度:70 °C最低工作温度:-25 °C
封装主体材料:PLASTIC/EPOXY封装代码:TSOP1
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
认证状态:Not Qualified座面最大高度:1.2 mm
标称供电电压:3 V表面贴装:YES
技术:CMOS电信集成电路类型:MODEM
温度等级:OTHER端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
宽度:8 mmBase Number Matches:1

MSM7582 数据手册

 浏览型号MSM7582的Datasheet PDF文件第18页浏览型号MSM7582的Datasheet PDF文件第19页浏览型号MSM7582的Datasheet PDF文件第20页浏览型号MSM7582的Datasheet PDF文件第21页浏览型号MSM7582的Datasheet PDF文件第22页浏览型号MSM7582的Datasheet PDF文件第23页 
¡ Semiconductor  
PACKAGE DIMENSIONS  
TSOPI32-P-814-0.50-1K  
MSM7582/7582B  
(Unit : mm)  
Mirror finish  
Package material  
Lead frame material  
Pin treatment  
Epoxy resin  
42 alloy  
Solder plating  
Solder plate thickness  
Package weight (g)  
5 mm or more  
0.27 TYP.  
Notes for Mounting the Surface Mount Type Package  
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which  
are very susceptible to heat in reflow mounting and humidity absorbed in storage.  
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the  
product name, package name, pin number, package code and desired mounting conditions  
(reflow method, temperature and times).  
24/24  

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