5秒后页面跳转
MSM7547 PDF预览

MSM7547

更新时间: 2024-01-04 23:13:36
品牌 Logo 应用领域
冲电气 - OKI /
页数 文件大小 规格书
7页 69K
描述
Voice Signal Level Control LSI

MSM7547 技术参数

生命周期:Obsolete零件包装代码:SOIC
包装说明:SOP, SOP16,.3针数:16
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.22JESD-30 代码:R-PDSO-G16
长度:10.5 mm功能数量:1
端子数量:16最高工作温度:70 °C
最低工作温度:-20 °C封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装等效代码:SOP16,.3
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
电源:5 V认证状态:Not Qualified
座面最大高度:2.1 mm子类别:Other Telecom ICs
最大压摆率:0.006 mA标称供电电压:5 V
表面贴装:YES电信集成电路类型:TELECOM CIRCUIT
温度等级:COMMERCIAL端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
宽度:5.3 mmBase Number Matches:1

MSM7547 数据手册

 浏览型号MSM7547的Datasheet PDF文件第1页浏览型号MSM7547的Datasheet PDF文件第2页浏览型号MSM7547的Datasheet PDF文件第3页浏览型号MSM7547的Datasheet PDF文件第4页浏览型号MSM7547的Datasheet PDF文件第5页浏览型号MSM7547的Datasheet PDF文件第6页 
¡ Semiconductor  
MSM7547  
PACKAGE DIMENSIONS  
(Unit : mm)  
SOP16-P-300-1.27-K  
Mirror finish  
Package material  
Lead frame material  
Pin treatment  
Solder plate thickness  
Package weight (g)  
Epoxy resin  
Cu alloy  
Solder plating  
5 mm or more  
0.21 TYP.  
Notes for Mounting the Surface Mount Type Package  
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which  
are very susceptible to heat in reflow mounting and humidity absorbed in storage.  
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the  
product name, package name, pin number, package code and desired mounting conditions  
(reflow method, temperature and times).  
7/7  

与MSM7547相关器件

型号 品牌 描述 获取价格 数据表
MSM7547MS-K OKI Voice Signal Level Control LSI

获取价格

MSM7555GS-2K OKI Modem, 2.4kbps Data, PQFP56, 9 X 10 MM, PLASTIC, QFP-56

获取价格

MSM7557 OKI Single Chip MSK Modem with Compandor for Cordless Telephone

获取价格

MSM7557GS-2K OKI Modem, 2.4kbps Data, PQFP56, 9 X 10 MM, 0.65 MM PITCH, PLASTIC, QFP-56

获取价格

MSM7560 OKI Single Rail ADPCM CODEC

获取价格

MSM7560GS-K OKI ADPCM Codec, MU-Law, 1-Func, PDSO28, PLASTIC, SOP-28

获取价格