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MSC1212Y3 PDF预览

MSC1212Y3

更新时间： 2024-02-05 01:09:55
品牌 Logo 应用领域
BB 转换器
页数 文件大小 规格书
69页 1095K
描述
Precision Analog-to-Digital Converter (ADC)

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MSC1212Y3 技术参数

是否无铅：不含铅是否Rohs认证：符合
生命周期：Active零件包装代码：QFP
包装说明：TQFP-64针数：64
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.31.00.01Factory Lead Time：1 week
风险等级：0.69Is Samacsys：N
具有ADC：YES其他特性：ALSO OPERATES AT 2.7V MINIMUM SUPPLY
地址总线宽度：16位大小：8
边界扫描：NOCPU系列：8051
最大时钟频率：40 MHzDAC 通道：YES
DMA 通道：NO外部数据总线宽度：8
格式：FIXED POINTJESD-30 代码：S-PQFP-G64
JESD-609代码：e4长度：10 mm
低功率模式：YES湿度敏感等级：4
DMA 通道数量：I/O 线路数量：32
串行 I/O 数：13端子数量：64
计时器数量：4片上程序ROM宽度：8
最高工作温度：125 °C最低工作温度：-40 °C
PWM 通道：YES封装主体材料：PLASTIC/EPOXY
封装代码：TFQFP封装等效代码：TQFP64,.47SQ
封装形状：SQUARE封装形式：FLATPACK, THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）：260电源：3/5 V
认证状态：Not QualifiedRAM（字节）：1280
RAM（字数）：160ROM（单词）：8192
ROM可编程性：FLASH座面最大高度：1.2 mm
速度：40 MHz子类别：Microcontrollers
最大供电电压：5.25 V最小供电电压：4.75 V
标称供电电压：5 V表面贴装：YES
技术：CMOS温度等级：AUTOMOTIVE
端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)端子形式：GULL WING
端子节距：0.5 mm端子位置：QUAD
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：10 mm
uPs/uCs/外围集成电路类型：MICROCONTROLLERBase Number Matches：1

MSC1212Y3 数据手册

 浏览型号MSC1212Y3的Datasheet PDF文件第1页浏览型号MSC1212Y3的Datasheet PDF文件第3页浏览型号MSC1212Y3的Datasheet PDF文件第4页浏览型号MSC1212Y3的Datasheet PDF文件第5页浏览型号MSC1212Y3的Datasheet PDF文件第6页浏览型号MSC1212Y3的Datasheet PDF文件第7页 
PACKAGE/ORDERING INFORMATION(1)  
SPECIFIED  
TEMPERATURE  
RANGE  
FLASH  
MEMORY  
PACKAGE  
DESIGNATOR  
PACKAGE  
MARKING  
PRODUCT  
PACKAGE-LEAD  
MSC1212Y2  
MSC1212Y2  
4k  
4k  
TQFP-64  
PAG  
"
–40°C to +85°C  
MSC1212Y2  
"
"
"
MSC1212Y3  
MSC1212Y3  
8k  
8k  
TQFP-64  
PAG  
"
–40°C to +85°C  
MSC1212Y3  
"
"
"
MSC1212Y4  
MSC1212Y4  
16k  
16k  
TQFP-64  
PAG  
"
–40°C to +85°C  
MSC1212Y4  
"
"
"
MSC1212Y5  
MSC1212Y5  
32k  
32k  
TQFP-64  
PAG  
"
–40°C to +85°C  
MSC1212Y5  
"
"
"
NOTE: (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or refer to our web  
site at www.ti.com/msc.  
ABSOLUTE MAXIMUM RATINGS(1)  
ELECTROSTATIC  
Analog Inputs  
DISCHARGE SENSITIVITY  
Input Current ............................................................ 100mA, Momentary  
Input Current .............................................................. 10mA, Continuous  
This integrated circuit can be damaged by ESD. Texas  
Instruments recommends that all integrated circuits be handled  
with appropriate precautions. Failure to observe proper han-  
dling and installation procedures can cause damage.  
Input Voltage .............................................AGND – 0.3V to AVDD + 0.3V  
Power Supply  
DVDD to DGND......................................................................–0.3V to 6V  
AVDD to AGND ......................................................................–0.3V to 6V  
AGND to DGND .............................................................. –0.3V to +0.3V  
V
REF to AGND ....................................................... –0.3V to AVDD + 0.3V  
ESD damage can range from subtle performance degrada-  
tion to complete device failure. Precision integrated circuits  
may be more susceptible to damage because very small  
parametric changes could cause the device not to meet its  
published specifications.  
Digital Input Voltage to DGND .............................. –0.3V to DVDD + 0.3V  
Digital Output Voltage to DGND ........................... –0.3V to DVDD + 0.3V  
Maximum Junction Temperature ................................................ +150°C  
Operating Temperature Range ...................................... –40°C to +85°C  
Storage Temperature Range ....................................... –65°C to +150°C  
Lead Temperature (soldering, 10s) ............................................ +235°C  
Package Power Dissipation ................................ (TJ Max - TAMBIENT)/θJA  
Output Current All Pins ................................................................ 200mA  
Output Pin Short Circuit .....................................................................10s  
Thermal Resistance, Junction-to-Ambient (θJA) High K (2s2p) 50.9°C/W  
Thermal Resistance, Junction-to-Ambient (θJA) Low K (1s) .... 76.2°C/W  
Thermal Resistance, Junction-to-Case (θJC) ........................... 12.5°C/W  
Digital Outputs  
Output Current ......................................................... 100mA, Continuous  
I/O Source/Sink Current ............................................................... 100mA  
Power Pin Maximum .................................................................... 300mA  
NOTE: (1) Stresses beyond those listed under Absolute Maximum Ratings may  
cause permanent damage to the device. Exposure to absolute-maximum-rated  
conditions for extended periods may affect device reliability.  
MSC1212Yx FAMILY FEATURES  
FEATURES(1)  
MSC1212Y2(2)  
MSC1212Y3(2)  
MSC1212Y4(2)  
MSC1212Y5(2)  
Flash Program Memory (Bytes)  
Flash Data Memory (Bytes)  
Up to 4k  
Up to 4k  
Up to 8k  
Up to 8k  
Up to 16k  
Up to 16k  
Up to 32k  
Up to 32k  
Internal Scratchpad RAM (Bytes)  
Internal MOVX SRAM (Bytes)  
Externally Accessible Memory (Bytes)  
256  
1024  
256  
1024  
256  
1024  
256  
1024  
64k Program, 64k Data  
64k Program, 64k Data  
64k Program, 64k Data  
64k Program, 64k Data  
NOTES: (1) All peripheral features are the same on all devices; the flash memory size is the only difference. (2) The last digit of the part number (N) represents  
the onboard flash size = (2N)kBytes.  
MSC1212  
2
SBAS278A  
www.ti.com  
1234567...69

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