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MPX2010D PDF预览

MPX2010D

更新时间: 2024-03-03 10:08:44
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
26页 677K
描述
Pressure Sensor, 10V, 0/10kPa, Sensor 4

MPX2010D 数据手册

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NXP Semiconductors  
MPX2010 Series  
10 kPa Temperature Compensated Pressure Sensors  
Contents  
1
General Description ............................................1  
2
3
4
5
Features and Benefits ........................................ 1  
Applications .........................................................1  
Ordering Information .......................................... 2  
Block Diagram .....................................................3  
Pin Information ....................................................3  
MPX2010D .........................................................3  
MPX2010DP ...................................................... 4  
MPX2010GP ......................................................4  
MPXM2010GS/GST1 .........................................5  
MPXV2010GP ....................................................5  
MPXV2010DP ....................................................6  
MPX2010GSX ....................................................6  
Maximum Ratings ............................................... 7  
Operating Characteristics .................................. 8  
Characteristics .................................................... 9  
Voltage output versus applied differential  
6
6.1  
6.2  
6.3  
6.4  
6.5  
6.6  
6.7  
7
8
9
9.1  
pressure .............................................................9  
On-chip temperature compensation and  
9.2  
calibration ...........................................................9  
Linearity ............................................................. 9  
Pressure (P1) / Vacuum (P2) side  
9.3  
9.4  
identification .....................................................10  
Media compatibility .......................................... 10  
Package Outlines .............................................. 12  
Small outline packages ....................................12  
Unibody packages ........................................... 16  
MPAK packages .............................................. 20  
References .........................................................22  
Revision history ................................................ 22  
Legal information ..............................................23  
9.5  
10  
10.1  
10.2  
10.3  
11  
12  
13  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section 'Legal information'.  
© NXP B.V. 2021.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 27 April 2021  
Document identifier: MPX2010  

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