TEMPERATURE COMPENSATION
Figure 2 shows the typical output characteristics of the
MPX10 series over temperature.
or by designing your system using the MPX2010D series
sensor.
Several approaches to external temperature compensa-
tion over both –40 to +125°C and 0 to +80°C ranges are
presented in Motorola Applications Note AN840.
The X–ducer piezoresistive pressure sensor element is a
semiconductor device which gives an electrical output signal
proportional to the pressure applied to the device. This de-
vice uses a unique transverse voltage diffused semiconduc-
tor strain gauge which is sensitive to stresses produced in a
thin silicon diaphragm by the applied pressure.
Because this strain gauge is an integral part of the silicon
diaphragm, there are no temperature effects due to differ-
ences in the thermal expansion of the strain gauge and the
diaphragm, as are often encountered in bonded strain gauge
pressure sensors. However, the properties of the strain
gauge itself are temperature dependent, requiring that the
device be temperature compensated if it is to be used over
an extensive temperature range.
LINEARITY
Linearity refers to how well a transducer’s output follows
the equation: V
= V + sensitivity x P over the operating
out
off
pressure range (Figure 3). There are two basic methods for
calculating nonlinearity: (1) end point straight line fit or (2) a
least squares best line fit. While a least squares fit gives the
“best case” linearity error (lower numerical value), the cal-
culations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola’s
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange
pressure.
Temperature compensation and offset calibration can be
achieved rather simply with additional resistive components,
80
70
70
60
50
–40°C
LINEARITY
60
+25°C
V
= 3 Vdc
P1 > P2
S
50
SPAN
RANGE
(TYP)
+125°C
ACTUAL
40
40
30
20
10
SPAN
(V
)
FSS
30
20
THEORETICAL
OFFSET
(TYP)
10
0
OFFSET
(V
0
PSI
)
0
0.3
2.0
0.6
4.0
PRESSURE DIFFERENTIAL
0.9
1.2
8.0
1.5
10
OFF
0
MAX
kPa
6.0
P
OP
PRESSURE (kPA)
Figure 2. Output versus Pressure Differential
Figure 3. Linearity Specification Comparison
SILICONE
DIE COAT
STAINLESS STEEL
METAL COVER
DIE
P1
P2
EPOXY
CASE
WIRE BOND
RTV DIE
BOND
LEAD FRAME
Figure 4. Cross–Sectional Diagram (not to scale)
Figure 4 illustrates the differential or gauge configuration
in the basic chip carrier (Case 344–15). A silicone gel iso-
lates the die surface and wire bonds from the environment,
while allowing the pressure signal to be transmitted to the sil-
icon diaphragm.
tics and internal reliability and qualification tests are based
on use of dry air as the pressure media. Media other than dry
air may have adverse effects on sensor performance and
long term reliability. Contact the factory for information re-
garding media compatibility in your application.
The MPX10 series pressure sensor operating characteris-
Motorola Sensor Device Data
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