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MPC8533E_10

更新时间: 2024-02-08 12:11:45
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飞思卡尔 - FREESCALE /
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112页 1289K
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Integrated Processor Hardware Specifications

MPC8533E_10 数据手册

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Document Number: MPC8533EEC  
Rev. 4, 09/2010  
Freescale Semiconductor  
Technical Data  
MPC8533E PowerQUICC III  
Integrated Processor  
Hardware Specifications  
Contents  
1 MPC8533E Overview  
This section provides a high-level overview of MPC8533E  
features. Figure 1 shows the major functional units within  
the device.  
1. MPC8533E Overview . . . . . . . . . . . . . . . . . . . . . . . . . .1  
2. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . .8  
3. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .13  
4. Input Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13  
5. RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . .16  
6. DDR and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . .16  
7. DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22  
8. Enhanced Three-Speed Ethernet (eTSEC),  
1.1  
Key Features  
MII Management . . . . . . . . . . . . . . . . . . . . . . . . . . . .23  
9. Ethernet Management Interface Electrical  
The following list provides an overview of the device feature  
set:  
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37  
10. Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39  
11. Programmable Interrupt Controller . . . . . . . . . . . . . .50  
12. JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51  
13. I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53  
14. GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55  
15. PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56  
16. High-Speed Serial Interfaces (HSSI) . . . . . . . . . . . . .58  
17. PCI Express . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68  
18. Package Description . . . . . . . . . . . . . . . . . . . . . . . . . .76  
19. Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .88  
20. Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .91  
21. System Design Information . . . . . . . . . . . . . . . . . . .100  
22. Device Nomenclature . . . . . . . . . . . . . . . . . . . . . . . .109  
23. Document Revision History . . . . . . . . . . . . . . . . . . .111  
High-performance, 32-bit core enhanced by  
resources for embedded cores defined by the Power  
ISA, and built on Power Architecture® technology:  
— 32-Kbyte L1 instruction cache and 32-Kbyte L1  
data cache with parity protection. Caches can be  
locked entirely or on a per-line basis, with  
separate locking for instructions and data.  
— Signal-processing engine (SPE) APU (auxiliary  
processing unit). Provides an extensive  
instruction set for vector (64-bit) integer and  
fractional operations. These instructions use both  
the upper and lower words of the 64-bit GPRs as  
they are defined by the SPE APU.  
© 2010 Freescale Semiconductor, Inc.  

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