是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Transferred | 包装说明: | BGA, |
Reach Compliance Code: | compliant | ECCN代码: | 3A991.A.2 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.68 |
地址总线宽度: | 26 | 位大小: | 32 |
边界扫描: | YES | 外部数据总线宽度: | 32 |
格式: | FIXED POINT | 集成缓存: | YES |
JESD-30 代码: | S-PBGA-B256 | JESD-609代码: | e1 |
长度: | 23 mm | 低功率模式: | YES |
湿度敏感等级: | 3 | 端子数量: | 256 |
最高工作温度: | 95 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | BGA |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
峰值回流温度(摄氏度): | 260 | 座面最大高度: | 2.54 mm |
速度: | 50 MHz | 最大供电电压: | 3.6 V |
最小供电电压: | 3 V | 标称供电电压: | 3.3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 1.27 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 23 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MPC850SRVR50BU | NXP |
获取价格 |
PowerQUICC, 32 Bit Power Architecture, 50MHz, Communications Processor, 0 to 95C | |
MPC850SRVR80BU | NXP |
获取价格 |
PowerQUICC, 32 Bit Power Architecture, 80MHz, Communications Processor, 0 to 95C | |
MPC850SRZQ50BU | NXP |
获取价格 |
PowerQUICC, 32 Bit Power Architecture, 50MHz, Communications Processor, 0 to 95C | |
MPC850SRZQ80BU | NXP |
获取价格 |
PowerQUICC, 32 Bit Power Architecture, 80MHz, Communications Processor, 0 to 95C | |
MPC850SRZT33A | MOTOROLA |
获取价格 |
RISC PROCESSOR, PBGA256, PLASTIC, BGA-256 | |
MPC850SRZT50A | MOTOROLA |
获取价格 |
RISC PROCESSOR, PBGA256, PLASTIC, BGA-256 | |
MPC850SRZT66A | MOTOROLA |
获取价格 |
RISC PROCESSOR, PBGA256, PLASTIC, BGA-256 | |
MPC850VR50BU | NXP |
获取价格 |
PowerQUICC, 32 Bit Power Architecture, 50MHz, Communications Processor, 0 to 95C | |
MPC850ZQ50BU | NXP |
获取价格 |
PowerQUICC, 32 Bit Power Architecture, 50MHz, Communications Processor, 0 to 95C | |
MPC852 | FREESCALE |
获取价格 |
CodeWarrior Development Studio |