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MMSZ5252CT1G

更新时间： 2024-02-05 15:35:14
品牌 Logo 应用领域
安森美 - ONSEMI 稳压器
页数 文件大小 规格书
7页 130K
描述
Zener Voltage Regulators 500 mW SOD−123 Surface Mount

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MMSZ5252CT1G 数据手册

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MMSZ52xxxT1G Series,  
SZMMSZ52xxxT1G Series  
Zener Voltage Regulators  
500 mW SOD−123 Surface Mount  
Three complete series of Zener diodes are offered in the convenient,  
surface mount plastic SOD−123 package. These devices provide a  
convenient alternative to the leadless 34−package style.  
http://onsemi.com  
Features  
• 500 mW Rating on FR−4 or FR−5 Board  
• Wide Zener Reverse Voltage Range − 2.4 V to 110 V  
• Package Designed for Optimal Automated Board Assembly  
• Small Package Size for High Density Applications  
• General Purpose, Medium Current  
SOD−123  
CASE 425  
STYLE 1  
• ESD Rating of Class 3 (> 16 kV) per Human Body Model  
1
2
Cathode  
Anode  
• SZ Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements; AEC−Q101 Qualified and  
PPAP Capable  
MARKING DIAGRAM  
• These are Pb−Free Devices*  
xx MG  
Mechanical Characteristics:  
1
G
CASE: Void-free, transfer-molded, thermosetting plastic case  
FINISH: Corrosion resistant finish, easily solderable  
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:  
260°C for 10 Seconds  
POLARITY: Cathode indicated by polarity band  
FLAMMABILITY RATING: UL 94 V−0  
xx = Device Code (Refer to page 3)  
M
G
= Date Code  
= Pb−Free Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
MAXIMUM RATINGS  
†
Rating  
Symbol  
Max  
Units  
Device  
Package  
Shipping  
Total Power Dissipation on FR−5 Board,  
P
MMSZ52xxBT1G,  
SZMMSZ52xxBT1G  
SOD−123  
(Pb−Free)  
3,000 /  
Tape & Reel  
D
(Note 1) @ T = 75°C  
500  
6.7  
mW  
L
Derated above 75°C  
mW/°C  
MMSZ52xxCT1G,  
SZMMSZ52xxCT1G  
SOD−123  
(Pb−Free)  
3,000 /  
Tape & Reel  
Thermal Resistance, Junction−to−Ambient  
(Note 2)  
R
340  
°C/W  
°C/W  
°C  
q
JA  
MMSZ52xxBT3G,  
SZMMSZ52xxBT3G  
SOD−123  
(Pb−Free)  
10,000 /  
Tape & Reel  
Thermal Resistance, Junction−to−Lead  
(Note 2)  
R
q
JL  
150  
MMSZ52xxCT3G,  
SZMMSZ52xxCT3G  
SOD−123  
(Pb−Free)  
10,000 /  
Tape & Reel  
Junction and Storage Temperature Range T , T  
−55 to +150  
J
stg  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. FR−5 = 3.5 X 1.5 inches, using the minimum recommended footprint.  
2. Thermal Resistance measurement obtained via infrared Scan Method.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics table on page 3 of  
this data sheet.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
October, 2012 − Rev. 12  
MMSZ5221BT1/D  
 
1234567

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