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MKW41Z512VHT4R PDF预览

MKW41Z512VHT4R

更新时间: 2024-01-20 11:51:33
品牌 Logo 应用领域
恩智浦 - NXP 外围集成电路
页数 文件大小 规格书
91页 1165K
描述
Microprocessor Circuit

MKW41Z512VHT4R 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:QCCN,Reach Compliance Code:compliant
ECCN代码:5A992HTS代码:8542.31.00.01
风险等级:1.56JESD-30 代码:S-XQCC-N48
湿度敏感等级:3端子数量:48
最高工作温度:105 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装代码:QCCN
封装形状:SQUARE封装形式:CHIP CARRIER
峰值回流温度(摄氏度):260最大供电电压:3.6 V
最小供电电压:1.71 V标称供电电压:3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:NO LEAD
端子位置:QUAD处于峰值回流温度下的最长时间:40
uPs/uCs/外围集成电路类型:MICROPROCESSOR CIRCUITBase Number Matches:1

MKW41Z512VHT4R 数据手册

 浏览型号MKW41Z512VHT4R的Datasheet PDF文件第2页浏览型号MKW41Z512VHT4R的Datasheet PDF文件第3页浏览型号MKW41Z512VHT4R的Datasheet PDF文件第4页浏览型号MKW41Z512VHT4R的Datasheet PDF文件第5页浏览型号MKW41Z512VHT4R的Datasheet PDF文件第6页浏览型号MKW41Z512VHT4R的Datasheet PDF文件第7页 
NXP Semiconductors  
MKW41Z512  
Data Sheet: Technical Data  
Rev. 4, 03/2018  
MKW41Z/31Z/21Z Data Sheet  
MKW41Z512  
A Bluetooth® Low Energy, IEEE® Standard 802.15.4,  
Generic FSK System on a Chip (SoC) Supports the  
following: MKW41Z512VHT4, MKW31Z512VHT4,  
MKW21Z512VHT4, MKW41Z256VHT4, MKW31Z256VHT4,  
MKW21Z256VHT4,MKW41Z512CAT4,MKW31Z512CAT4  
MKW31Z512  
MKW21Z512  
MKW41Z256  
MKW31Z256  
MKW21Z256  
48 LQFN  
7 x 7 x 0.98 mm Pitch 3.893 x 3.797 x 0.564  
0.5 mm mm Pitch 0.4 mm  
75 WLCSP  
Multi-Standard Radio  
System peripherals  
• 2.4 GHz Bluetooth Low Energy ver. 4.2 compliant  
supporting up to 2 simultaneous hardware connections  
• IEEE Std. 802.15.4 compliant with dual-PAN support  
• Generic FSK modulation  
• Nine MCU low-power modes to provide power  
optimization based on application requirements  
• DC-DC Converter supporting Buck, Boost, and  
Bypass operating modes  
• Data Rate: 250, 500 and 1000 kbps  
• Modulations: GFSK BT = 0.3, 0.5, 0.7; FSK/MSK  
• Modulation Index: 0.32, 0.5, or 0.7  
• Direct memory access(DMA) Controller  
• Computer operating properly(COP) watchdog  
• Serial wire debug(SWD) Interface and Micro Trace  
buffer  
• Typical Receiver Sensitivity (BLE) = -95 dBm  
• Typical Receiver Sensitivity (802.15.4) = -100 dBm  
• Typical Receiver Sensitivity (250 kbps GFSK-BT=0.5,  
h=0.5) = -100 dBm  
• Bit Manipulation Engine (BME)  
Analog Modules  
• 16-bit Analog-to-Digital Converter (ADC)  
• 12-bit Digital-to-Analog Converter (DAC)  
• 6-bit High Speed Analog Comparator (CMP)  
• 1.2 V voltage reference (VREF)  
• Prog Transmitter Output Power: -30 dBm to 3.5 dBm  
• Low external component counts for low cost application  
• On-chip balun with single ended bidirectional RF port  
MCU and Memories  
Timers  
• Up to 48 MHz ARM® Cortex-M0+ core  
• On-chip 512/256 KB Flash memory  
• On-chip 128/64 KB SRAM  
• 16-bit low-power timer (LPTMR)  
• 3 Timers Modules(TPM): One 4 channel TPM and  
two 2 channel TPMs  
Low Power Consumption  
• Programmable Interrupt Timer (PIT)  
• Real-Time Clock (RTC)  
• Transceiver current (DC-DC buck mode, 3.6 V supply)  
• Typical Rx Current: 6.8 mA  
Communication interfaces  
• Typical Tx current: 6.1 mA (0 dBm output)  
• Low Power Mode (VLLS0) Current: 182 nA  
• 2 serial peripheral interface (SPI) modules  
• 2 inter-integrated circuit (I2C) modules  
NXP reserves the right to change the production detail specifications as may be  
required to permit improvements in the design of its products.  

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