Features
Applications
■ 100 % electrically compatible with all
High Density Circuit Board Applications:
■ Hard disk drives
previous generations of 1812 SMT devices
■ Compatible with Pb and Pb-free solder
reflow profiles
■ Surface mount packaging for automated
assembly
■ RoHS compliant*
■ PC motherboards
■ PC peripherals
■ Point-of-sale (POS) equipment
■ PCMCIA cards
■ USB ports
T
V Rheinland
■ Agency recognition:
MF-MSMF Series - PTC Resettable Fuses
Electrical Characteristics
Tripped
Power
Dissipation
Max. Time
To Trip
I
I
trip
Resistance
hold
V max.
Volts
I max.
Amps
Model
Amperes
at 23 °C
Ohms
Amperes Seconds
Watts
at 23 °C
at 23 °C
at 23 °C
at 23 °C
R
R
Hold
0.10
0.14
0.20
0.30
0.50
0.75
0.75
1.10
1.10
1.25
1.50
1.60
2.00
2.50
2.60
Trip
Min.
1Max.
Typ.
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
MF-MSMF010
MF-MSMF014
MF-MSMF020
MF-MSMF030
MF-MSMF050
MF-MSMF075
MF-MSMF075/24
MF-MSMF110
MF-MSMF110/16
MF-MSMF125
MF-MSMF150
MF-MSMF160
MF-MSMF200
MF-MSMF250/16
MF-MSMF260
60.0
60.0
30.0
30.0
15.0
13.2
24.0
6.0
16.0
6.0
6.0
8.0
8.0
40
40
80
0.30
0.34
0.40
0.60
1.00
1.50
1.50
2.20
2.20
2.50
3.00
2.80
4.00
5.00
5.20
0.70
0.40
0.40
0.30
0.15
0.11
0.11
0.04
0.04
0.035
0.03
0.035
0.020
0.015
0.015
15.00
6.50
6.00
3.00
1.00
0.45
0.45
0.21
0.21
0.5
1.5
6.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
1.50
0.15
0.06
0.10
0.15
0.20
0.20
0.30
0.30
0.40
0.5
10
100
100
40
100
100
100
100
100
40
0.14
0.120
0.099
0.080
0.100
0.080
2.0
3.0
5.0
5.0
16.0
6.0
100
100
Environmental Characteristics
Operating Temperature ......................................-40 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State ................................................125 °C
Passive Aging......................................................+85 °C, 1000 hours .................................... 5 ꢀ typical resistance change
Humidity Aging....................................................+85 °C, 85 ꢀ R.H. 1000 hours .................. 5 ꢀ typical resistance change
Thermal Shock....................................................+85 °C to -40 °C, 20 times ........................ 10 ꢀ typical resistance change
Solvent Resistance ............................................MIL-STD-202, Method 215 ........................No change
Vibration..............................................................MIL-STD-883C, Method 2007.1, ................No change
Condition A
Test Procedures And Requirements For Model MF-MSMF Series
Test
Test Conditions
Accept/Reject Criteria
Visual/Mech.....................................Verify dimensions and materials ....................................Per MF physical description
Resistance ......................................In still air @ 23 °C............................................................Rmin ≤ R ≤ R1max
Time to Trip ....................................At specified current, Vmax, 23 °C ..................................T ≤ max. time to trip (seconds)
Hold Current ..................................30 min. at Ihold ..............................................................No trip
Trip Cycle Life ................................Vmax, Imax, 100 cycles..................................................No arcing or burning
Trip Endurance................................Vmax, 48 hours ..............................................................No arcing or burning
Solderability ....................................ANSI/J-STD-002 ............................................................95 ꢀ min. coverage
UL File Number ..................................E174545
http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545
CSA File Number................................CA110338
http://directories.csa-international.org/ Under “Certification Record” and “File Number” enter 110338-0-000
(Model MF-MSMF110 is CSA approved)
TÜV Certificate Number......................R 02057213
http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 2057213
(Model MF-MSMF110 is TÜV approved)
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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