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MCP23008T-E/P

更新时间： 2024-02-21 20:17:16

品牌	Logo	应用领域
美国微芯 - MICROCHIP		/
页数	文件大小	规格书
40页	500K
描述
8-Bit I/O Expander with Serial Interface

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技术参数
数据手册

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MCP23008T-E/P 技术参数

生命周期：	Active	包装说明：	SSOP-20
Reach Compliance Code：	compliant	风险等级：	5.73
JESD-30 代码：	R-PDSO-G20	长度：	7.2 mm
I/O 线路数量：	8	端口数量：	1
端子数量：	20	最高工作温度：	125 °C
最低工作温度：	-40 °C	封装主体材料：	PLASTIC/EPOXY
封装代码：	SSOP	封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE, SHRINK PITCH	筛选级别：	AEC-Q100
座面最大高度：	2 mm	最大供电电压：	5.5 V
最小供电电压：	4.5 V	标称供电电压：	5 V
表面贴装：	YES	技术：	CMOS
温度等级：	AUTOMOTIVE	端子形式：	GULL WING
端子节距：	0.65 mm	端子位置：	DUAL
宽度：	5.3 mm	uPs/uCs/外围集成电路类型：	PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches：	1

MCP23008T-E/P 数据手册

MCP23008/MCP23S08

FIGURE 1-1:

MCP23008 I²C™ DEVICE PROTOCOL

- START

- RESTART

DIN

ADDR

....

- STOP

- Write

- Read

DOUT

DIN

OUT

....

- Device opcode

ADDR - Device address

- Data out from MCP23008

- Data into MCP23008

DOUT

DIN

DOUT

....

DOUT

....

DIN

....

DIN

ADDR

Byte and Sequential Write

DIN

ADDR

Byte

DIN

....

Sequential

Byte and Sequential Read

Byte

OUT

Sequential

DOUT

SR OP

....

1.3.3.3

SPI Sequential Write/Read

1.4

Hardware Address Decoder

For sequential operations, instead of deselecting the

device by raising CS, the master clocks the next byte

pointed to by the address pointer.

The hardware address pins are used to determine the

device address. To address a device, the correspond-

ing address bits in the control byte must match the pin

state.

The sequence ends by the raising of CS.

• MCP23008 has address pins A2, A1 and A0.

• MCP23S08 has address pins A1 and A0.

The MCP23S08 address pointer will roll over to

address zero after reaching the last register address.

The pins must be biased externally.

DS21919B-page 5

1 2 3 456 7 8...40

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