Datasheet > MCI0603TN1N4CHBP

MCI0603TN1N4CHBP

更新时间： 2024-04-09 18:56:52

品牌	Logo	应用领域
华新科技 - WALSIN		/
页数	文件大小	规格书
10页	543K
描述
Multi-Layer High Frequency Chip Inductor / MCI Series 1.4, 14, 600mA

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MCI0603TN1N4CHBP 数据手册

Item

Test Condition

Requirements

1. Solder the chip to test jig then apply a

force in the direction shown in below.

2. The soldering shall be done with the

reflow method and shall be conducted

with care so that the soldering is uniform

and free of defects such as heat shock.

Bending Strength

No mechanical damage

⚫

NOTE

The storage atmosphere must be free of gas containing sulfur and chlorine. Also, avoid

exposing the product to saline moisture. If the product is exposed to such atmospheres,

the terminals will oxidize and solderability will be affected.

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