Datasheet > MCI0603TM75NHHBP

MCI0603TM75NHHBP

更新时间： 2024-04-09 18:56:31

品牌	Logo	应用领域
华新科技 - WALSIN		/
页数	文件大小	规格书
11页	680K
描述
Multi-Layer High Frequency Chip Inductor / MCI-TM Series 75, 8, 0.1A

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MCI0603TM75NHHBP 数据手册

Item

Test Condition

Requirements

1. Solder the chip to test jig then apply a

force in the direction shown in below.

2. The soldering shall be done with the

reflow method and shall be conducted

with care so that the soldering is uniform

and free of defects such as heat shock.

Bending Strength

No mechanical damage

⚫

NOTE

The storage atmosphere must be free of gas containing sulfur and chlorine. Also, avoid

exposing the product to saline moisture. If the product is exposed to such atmospheres,

the terminals will oxidize and solderability will be affected.

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型号	品牌	描述	获取价格	数据表
MCI0603TM75NJHBP	WALSIN	Multi-Layer High Frequency Chip Inductor / MCI-TM Series 75, 8, 0.1A	获取价格
MCI0603TM7N5HHBP	WALSIN	Multi-Layer High Frequency Chip Inductor / MCI-TM Series 7.5, 14, 0.3A	获取价格
MCI0603TM7N5JHBP	WALSIN	Multi-Layer High Frequency Chip Inductor / MCI-TM Series 7.5, 14, 0.3A	获取价格
MCI0603TM8N2HHBP	WALSIN	Multi-Layer High Frequency Chip Inductor / MCI-TM Series 8.2, 14, 0.25A	获取价格
MCI0603TM8N2JHBP	WALSIN	Multi-Layer High Frequency Chip Inductor / MCI-TM Series 8.2, 14, 0.25A	获取价格
MCI0603TM9N1HHBP	WALSIN	Multi-Layer High Frequency Chip Inductor / MCI-TM Series 9.1, 14, 0.25A	获取价格