Datasheet > MCI0603TG0N7BHBP

MCI0603TG0N7BHBP

更新时间： 2024-04-09 18:56:53

品牌	Logo	应用领域
华新科技 - WALSIN		/
页数	文件大小	规格书
17页	892K
描述
Multi-Layer High Frequency Chip Inductor / MCI Series 0.7, 12, 750mA

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MCI0603TG0N7BHBP 数据手册

Item

Test Condition

Requirements

1. Solder the chip to test jig then apply a

force in the direction shown in below.

2. The soldering shall be done with the

reflow method and shall be conducted with

care so that the soldering is uniform and free

of defects such as heat shock.

Bending Strength

No mechanical damage

⚫ NOTE

The storage atmosphere must be free of gas containing sulfur and chlorine. Also, avoid

exposing the product to saline moisture. If the product is exposed to such atmospheres,

the terminals will oxidize and solderability will be affected.

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型号	品牌	描述	获取价格	数据表
MCI0603TG0N7CHBP	WALSIN	Multi-Layer High Frequency Chip Inductor / MCI Series 0.7, 12, 750mA	获取价格
MCI0603TG0N8BHBP	WALSIN	Multi-Layer High Frequency Chip Inductor / MCI Series 0.8, 12, 750mA	获取价格
MCI0603TG0N8CHBP	WALSIN	Multi-Layer High Frequency Chip Inductor / MCI Series 0.8, 12, 750mA	获取价格
MCI0603TG0N9BHBP	WALSIN	Multi-Layer High Frequency Chip Inductor / MCI Series 0.9, 12, 700mA	获取价格
MCI0603TG0N9CHBP	WALSIN	Multi-Layer High Frequency Chip Inductor / MCI Series 0.9, 12, 700mA	获取价格
MCI0603TG10NHHBP	WALSIN	Multi-Layer High Frequency Chip Inductor / MCI Series 10, 11, 250mA	获取价格