Datasheet > MC33981PNATAD

MC33981PNATAD

更新时间： 2024-09-29 20:52:23

品牌	Logo	应用领域
恩智浦 - NXP		驱动接口集成电路
页数	文件大小	规格书
4页	209K
描述
BUF OR INV BASED PRPHL DRVR

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MC33981PNATAD 技术参数

生命周期：	Transferred	包装说明：	,
Reach Compliance Code：	unknown	风险等级：	5.6
接口集成电路类型：	BUFFER OR INVERTER BASED PERIPHERAL DRIVER	Base Number Matches：	1

MC33981PNATAD 数据手册

Document order number: MC33981PNATAD

Rev 3.0, 05/2012

Freescale Semiconductor

Technical Data

High Frequency High-Current

Self-Protected High-Side

Switch (4.0 mOhm up to 60 kHz)

33981

INTRODUCTION

High-Side Switch

This thermal addendum is provided as a supplement to the MC33981 technical

datasheet. The addendum provides thermal performance information that may be

critical in the design and development of system applications. All electrical,

application, and packaging information is provided in the datasheet.

PACKAGING AND THERMAL CONSIDERATIONS

This package is a dual die package. There are two heat sources in the package

independently heating with P₁and P₂. This results in two junction temperatures,

T_J1and T_J2, and a thermal resistance matrix with R_θJAmn

For m, n = 1, R_θJA11is the thermal resistance from Junction 1 to the reference

temperature while only heat source 1 is heating with P₁.

98ARL10521D

16-PIN PQFN

12 mm x 12 mm

For m = 1, n = 2, R_θJA12is the thermal resistance from Junction 1 to the

reference temperature while heat source 2 is heating with P₂. This applies to

R_θJ21and R_θJ22, respectively.

Note For package dimensions, refer to

98ARL10521D.

R_θJA11R_θJA12

R_θJA21R_θJA22

T_J1

T_J2

P₁

P₂

The stated values are solely for a thermal performance comparison of one package to another in a standardized environment.

This methodology is not meant to and will not predict the performance of a package in an application-specific environment. Stated

values were obtained by measurement and simulation according to the standards listed below.

STANDARDS

Table 1. Thermal Performance Comparison

1 = Power Chip, 2 = Logic Chip [°C/W]

Thermal

m = 1,

n = 1

m = 1, n = 2

m = 2, n = 1

m = 2,

n = 2

Resistance

(1) (2)

7.0

4.0

1.0

θJAmn

θJBmn

θJAmn

θJCmn

0.2 mm spacing

between PCB pads

(2) (3)

(1) (4)

(5)

<1.0

0.0

Notes

0.2 mm spacing

1. Per JEDEC JESD51-2 at natural convection, still air

condition.

between PCB pads

2. 2s2p thermal test board per JEDEC JESD51-7and

JESD51-5.

Note: Recommended via diameter is 0.5 mm. PTH (plated through

hole) via must be plugged / filled with epoxy or solder mask in order

to minimize void formation and to avoid any solder wicking into the

via.

3. Per JEDEC JESD51-8, with the board temperature on the

center trace near the power outputs.

4. Single layer thermal test board per JEDEC JESD51-3 and

JESD51-5.

Figure 1. Surface mount for power PQFN

with exposed pads

5. Thermal resistance between the die junction and the

exposed pad, “infinite” heat sink attached to exposed pad.

Freescale Semiconductor, Inc. reserves the right to change the detail specifications,

as may be required, to permit improvements in the design of its products.

12 3 4

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与MC33981PNATAD相关器件

型号	品牌	获取价格	描述	数据表
MC33982	MOTOROLA	获取价格	Single Intelligent High-Current Self-Protected Silicon High-Side Switch
MC33982BPNA	FREESCALE	获取价格	Single Intelligent High-current Self-protected Silicon High Side Switch (2.0m ohm)
MC33982BPNA/R2	FREESCALE	获取价格	Single Intelligent High-current Self-protecte
MC33982BPNAR2	FREESCALE	获取价格	Single Intelligent High-Current Self-Protected Silicon High-Side Switch (2.0 mohm)
MC33982CHFK	FREESCALE	获取价格	Single Intelligent High-current Self-protected High Side Switch (2.0 mOhm)
MC33982CHFK	NXP	获取价格	High-Side Switch, 12V, Single 2mOhms, PQFN 16
MC33982CHFKR2	NXP	获取价格	High-Side Switch, 12V, Single 2m?, PQFN 16, Reel
MC33982CPNA/R2	FREESCALE	获取价格	Single Intelligent High-current Self-protecte
MC33982PNA	MOTOROLA	获取价格	Single Intelligent High-Current Self-Protected Silicon High-Side Switch
MC33982PNA/R2	MOTOROLA	获取价格	Single Intelligent High-Current Self-Protected Silicon High-Side Switch

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