Datasheet > MB2029300YL

MB2029300YL

更新时间： 2024-01-05 13:39:31

品牌	Logo	应用领域
ABC		/
页数	文件大小	规格书
6页	219K
描述
HIGH CURRENT MULTILAYER CHIP BEAD

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数据手册

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MB2029300YL 数据手册

SPECIFICATION FOR APPROVAL

REF :

PAGE: 1

20090527-A

PROD.

NAME

ABC'S DWG NO.

ABC'S ITEM NO.

MB□□□□□□□□L□-□□□

HIGH CURRENT MULTILAYER

CHIP BEAD

Ⅰ﹒CONFIGURATION & DIMENSIONS：

( PCB Pattern )

Unit : m/m

Series

MB4532

MB4516

MB3261

MB2029

MB1608

4.5±0.2

3.2±0.2

2.0±0.2

1.6±0.2

3.2±0.2

1.6±0.2

1.2±0.2

0.8±0.2

0.6±0.4

0.5±0.3

0.3±0.2

3.0

2.2

1.0

0.7

3.0

1.4

1.0

0.7

1.5

1.1

1.0

0.7

1.5±0.2

1.6±0.2

1.1±0.2

0.9±0.2

0.8±0.2

Ⅱ﹒SCHEMATIC DIAGRAM：

Ⅲ﹒MATERIALS：

a﹒Body：Ferrite

b﹒Internal conductor：Silver or Ag / Pd

c﹒Terminal：Ag/Ni/Sn

d﹒Remark：Products comply with RoHS'

requirements

Ⅳ﹒GENERAL SPECIFICATION：

a﹒Storage temp.：-40℃ ---- +105℃

b﹒Operating temp.：-55℃ ---- +125℃

c﹒Terminal strength：

Peak Temp：260℃ max.

Max time above 230℃ ：50sec max.

Max time above 200℃ ：70sec max.

Temperature

Rising Area

Preheat Area

Reflow Area

Forced Cooling Area

Type

F ( kgf )

1.5

Time ( sec )

+2.0 ~ 4.0℃

/ sec max.

+4.0℃ / sec max.

150 ~ 200℃ / 60 ~ 120sec

-(1.0 ~ 5.0)℃ / sec max.

MB4532

Peak Temperature:

260℃

MB4516

MB3261

MB2029

1.0

0.6

250

200

150

100

230℃

50sec max.

30±5

MB1608

0.5

70sec max.

d﹒Solderability：

Solder : Sn96.5 / Ag3 / Cu0.5

or equivalent

Solder temp. : 260±5℃

Flux : Rosin

Dip time : 4±1 seconds

100

150

Time ( seconds )

200

250

AR-001A

12 3 4 5 6

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