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MAX9867ETJ+TG3U

更新时间： 2024-01-16 20:41:17
品牌 Logo 应用领域
美信 - MAXIM PC电信电信集成电路
页数 文件大小 规格书
55页 974K
描述
IC STEREO AUD CODEC LP 32TQFN

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MAX9867ETJ+TG3U 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：,
Reach Compliance Code：compliantFactory Lead Time：15 weeks
风险等级：5.75峰值回流温度（摄氏度）：NOT SPECIFIED
电信集成电路类型：PCM CODEC处于峰值回流温度下的最长时间：NOT SPECIFIED
Base Number Matches：1

MAX9867ETJ+TG3U 数据手册

 浏览型号MAX9867ETJ+TG3U的Datasheet PDF文件第1页浏览型号MAX9867ETJ+TG3U的Datasheet PDF文件第3页浏览型号MAX9867ETJ+TG3U的Datasheet PDF文件第4页浏览型号MAX9867ETJ+TG3U的Datasheet PDF文件第5页浏览型号MAX9867ETJ+TG3U的Datasheet PDF文件第6页浏览型号MAX9867ETJ+TG3U的Datasheet PDF文件第7页 
Ultra-Low Power Stereo Audio Codec  
ABSOLUTE MAXIMUM RATINGS  
(Voltages with respect to AGND.)  
Continuous Power Dissipation (T = +70°C)  
A
DVDD, AVDD, and PVDD.........................................-0.3V to +2V  
DVDDIO.................................................................-0.3V to +3.6V  
DGND and PGND..................................................-0.1V to +0.1V  
PREG, REF, REG, MICBIAS ....................-0.3V to (AVDD + 0.3V)  
MCLK, LRCLK, BCLK  
SDOUT, SDIN .................................-0.3V to (DVDDIO + 0.3V)  
SDA, SCL, IRQ ......................................................-0.3V to +3.6V  
LOUTP, LOUTN, ROUTP,  
30-Bump WLP (derate 12.5mW/°C above +70°C)....1000mW  
32-Pin TQFN-EP (derate 34.5mW/°C above +70°C).2759mW  
Junction-to-Ambient Thermal Resistance (θ ) (Note 1)  
JA  
30-Bump WLP .............................................................80°C/W  
32-Pin TQFN-EP ..........................................................29°C/W  
Operating Temp Range.......................................-40°C to +85°C  
Storage Temp Range ........................................-65°C to +150°C  
Lead Temperature (TQFN only, 10s) ...............................+300°C  
Soldering Temperature (reflow) .......................................+260°C  
MAX9867  
ROUTN.................................(PGND - 0.3V) to (PVDD + 0.3V)  
LINL, LINR, JACKSNS/AUX, MICLP/DIGMICDATA,  
MICLN/DIGMICCLK, MICRP, MICRN..-0.3V to (AVDD + 0.3V)  
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-  
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional  
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to  
absolute maximum rating conditions for extended periods may affect device reliability.  
ELECTRICAL CHARACTERISTICS  
(V  
= V  
REF  
= V  
= 2.2µF, C  
= V  
MICBIAS  
= +1.8V, R = ∞, headphone load (R ) connected between _OUTP and _OUTN in differential  
AVDD  
PVDD  
DVDD  
DVDDIO  
= C  
L
L
mode, C  
= C  
= 1µF, AV  
= +20dB, AV  
= 0dB, AV  
= 0dB, AV  
= +20dB, AV  
=
PREG  
REG  
PRE  
PGAM  
DAC  
LINE  
VOL  
0dB, MCLK = 13MHz, T = T  
to T  
, unless otherwise noted. Typical values are at T = +25°C.) (Note 2)  
MAX A  
A
MIN  
PARAMETER  
SYMBOL  
CONDITIONS  
PVDD, DVDD, AVDD  
MIN  
1.65  
1.65  
TYP  
MAX  
1.95  
3.6  
UNITS  
1.8  
1.8  
Supply Voltage Range  
V
DVDDIO  
Analog (AVDD +  
PVDD)  
4.65  
0.96  
3.28  
1.40  
8.0  
7
1.5  
5
Full-duplex 8kHz  
mono (voice mode)  
(Note 3)  
Digital (DVDD +  
DVDDIO)  
Analog (AVDD +  
PVDD)  
DAC playback 48kHz  
stereo (audio mode)  
(Note 3)  
Digital (DVDD +  
DVDDIO)  
2
Total Supply Current  
I
mA  
VDD  
Analog (AVDD +  
PVDD)  
12  
3
Full-duplex 48kHz  
stereo (audio mode)  
(Note 3)  
Digital (DVDD +  
DVDDIO)  
2.0  
Analog (AVDD +  
PVDD)  
3.8  
6
Stereo line-in only  
Digital (DVDD +  
DVDDIO)  
0.004  
1
0.05  
5
Analog (AVDD +  
PVDD)  
Shutdown Supply Current  
T
= +25°C  
µA  
A
Digital (DVDD +  
DVDDIO)  
1
5
2
_______________________________________________________________________________________  
1234567...55

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