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MAX9776EBX+T PDF预览

MAX9776EBX+T

更新时间: 2024-02-02 05:53:25
品牌 Logo 应用领域
美信 - MAXIM 音频控制集成电路消费电路商用集成电路放大器信息通信管理
页数 文件大小 规格书
37页 557K
描述
2 x 1.5W, Stereo Class D Audio Subsystem with DirectDrive Headphone Amplifier

MAX9776EBX+T 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Not Recommended零件包装代码:QFN
包装说明:HVQCCN, LCC32,.2SQ,20针数:32
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.33.00.01Factory Lead Time:18 weeks
风险等级:5.23信道分离:75 dB
商用集成电路类型:VOLUME CONTROL CIRCUITJESD-30 代码:S-XQCC-N32
JESD-609代码:e3长度:5 mm
湿度敏感等级:1信道数量:1
功能数量:1端子数量:32
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装代码:HVQCCN
封装等效代码:LCC32,.2SQ,20封装形状:SQUARE
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度(摄氏度):260
电源:3.3 V认证状态:Not Qualified
座面最大高度:0.8 mm子类别:Audio/Video Amplifiers
最大压摆率:18 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):2.7 V表面贴装:YES
技术:BICMOS温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn)端子形式:NO LEAD
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:5 mm
Base Number Matches:1

MAX9776EBX+T 数据手册

 浏览型号MAX9776EBX+T的Datasheet PDF文件第1页浏览型号MAX9776EBX+T的Datasheet PDF文件第3页浏览型号MAX9776EBX+T的Datasheet PDF文件第4页浏览型号MAX9776EBX+T的Datasheet PDF文件第5页浏览型号MAX9776EBX+T的Datasheet PDF文件第6页浏览型号MAX9776EBX+T的Datasheet PDF文件第7页 
2 x 1.5W, Stereo Class D Audio Subsystem  
with DirectDrive Headphone Amplifier  
ABSOLUTE MAXIMUM RATINGS  
DD  
V
to GND..............................................................................6V  
Duration of Short Circuit Between  
PV  
CPV  
to PGND .........................................................................6V  
OUT_+ and OUT_- ..................................................Continuous  
Duration of HP_, OUT_ Short Circuit to  
DD  
to CPGND....................................................................6V  
DD  
CPV to CPGND.....................................................-6V to +0.3V  
GND or PV ..........................................................Continuous  
Continuous Power Dissipation (T = +70°C)  
A
SS  
DD  
V
SS  
to CPGND..........................................................-6V to +0.3V  
C1N.......................................(CPV - 0.3V) to (CPGND + 0.3V)  
32-Bump (3mm x 3mm) UCSP Multilayer Board  
(derate 17.0mW/°C above +70°C)...........................1360.5mW  
32-Pin (5mm x 5mm) TQFN Single-Layer Board  
SS  
C1P.......................................(CPGND - 0.3V) to (CPV  
+ 0.3V)  
+ 0.3V)  
DD  
HPL, HPR to GND...................(CPV - 0.3V) to (CPV  
SS  
DD  
GND to PGND and CPGND................................................ 0.3V  
to PV and CPV .................................................... 0.3V  
(derate 21.3mW/°C above +70°C)...........................1702.1mW  
32-Pin TQFN Multilayer Board (derate 34.5mW/°C  
above +70°C)...........................................................2758.6mW  
Junction Temperature......................................................+150°C  
Operating Temperature Range ...........................-40°C to +85°C  
Storage Temperature Range.............................-65°C to +150°C  
Lead Temperature (soldering, 10s) .................................+300°C  
V
DD  
DD  
DD  
SDA, SCL to GND.....................................................-0.3V to +6V  
All other pins to GND..................................-0.3V to (V + 0.3V)  
DD  
Continuous Current In/Out of PV , PGND, CPV , CPGND,  
DD  
DD  
OUT__, HPR, and HPL.................................................. 800mA  
Continuous Input Current CPV ......................................260mA  
SS  
Continuous Input Current (all other pins) ......................... 20mA  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional  
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to  
absolute maximum rating conditions for extended periods may affect device reliability.  
5/MAX976  
ELECTRICAL CHARACTERISTICS  
(V  
= PV  
= CPV  
= 3.3V, GND = PGND = CPGND = 0V, SHDN = V , I2C settings (INA gain = +20dB, INB gain = INC gain =  
DD  
DD  
DD DD  
0dB, volume setting = 0dB, mono path gain = 0dB, SHDN = 1, SSM = 1). Speaker load resistors (R  
) are terminated between  
LSP  
OUT_+ and OUT_-, headphone load resistors are terminated to GND, unless otherwise noted. C1 = C2 = C3 = 1µF. T = T  
to  
A
MIN  
T
MAX  
, unless otherwise noted. Typical values are at T = +25°C.) (Note 1)  
A
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
GENERAL  
V
, P  
PVDD  
,
DD VDD  
C
Supply Voltage Range  
Inferred from PSRR test  
2.7  
5.5  
V
Output mode 1, 6, 11 (Rx mode)  
Output mode 4, 9, 14 (HP mode)  
Output mode 2, 7, 12 (SP mode)  
Output mode 3, 8, 13 (SP and HP mode)  
Output mode 1, 6, 11 (Rx mode)  
Output mode 4, 9, 14 (HP mode)  
Output mode 2, 7, 12 (SP mode)  
Output mode 3, 8, 13 (SP and HP mode)  
Current in mute (low power)  
6.3  
8
10  
12.6  
15  
Quiescent Current (Mono)  
Quiescent Current (Stereo)  
I
I
mA  
mA  
DD  
DD  
9.5  
12.9  
7
18  
9
16.5  
20  
Mute Current  
I
4.7  
0.1  
10  
10  
mA  
µA  
MUTE  
Hard shutdown  
SHDN = GND  
2
Shutdown Current  
I
SHDN  
See the I C Interface  
section  
Soft shutdown  
8.5  
30  
28  
15  
Time from shutdown or power-on to full  
operation  
Turn-On Time  
t
ms  
ON  
B and C pair inputs, T = +25°C,  
A
VOL = max  
17.5  
41.0  
k  
Input Resistance  
R
IN  
A pair inputs, T = +25°C, +20dB  
3.5  
45  
5.5  
50  
8.0  
60  
kΩ  
dB  
V
A
Common-Mode Rejection Ratio  
Input DC Bias Voltage  
CMRR  
T = +25°C, f = 1kHz (Note 2)  
A IN  
V
IN_ inputs  
1.12  
1.25  
1.38  
BIAS  
2
_______________________________________________________________________________________  

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