Datasheet > MAX38643

MAX38643

更新时间： 2023-12-20 18:44:49

品牌	Logo	应用领域
亚德诺 - ADI		转换器
页数	文件大小	规格书
18页	994K
描述
微小尺寸、1.8V–5.5V输入、330nA IQ、700mA nanoPower降压型转换器

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MAX38643 数据手册

MAX38640–MAX38643

Tiny 1.8V to 5.5V Input, 330nA I , 700mA

nanoPower Buck Converter

Absolute Maximum Ratings

IN, EN, R

, NC, OUT to GND............................... -0.3V to +6V

Continuous Power Dissipation—µDFN (T = +70°C) (Derate

SEL

LX RMS Current WLP ............................. -1.6A

LX RMS Current µDFN.................................. -1A

LX to GND (Note 1)........................................-0.3V to V + 0.3V

to +1.6A

4.5mW/°C above +70°C) ...............................................357.8mW

Operating Temperature Range.............................-40°C to +85°C

Maximum Junction Temperature ......................................+150°C

Storage Temperature Range ..............................-65°C to +150°C

Lead Temperature (soldering, 10 seconds)......................+300°C

Soldering Temperature (reflow) ........................................+260°C

RMS

to +1A

RMS

Continuous Power Dissipation—WLP (T = +70°C) (Derate

10.5mW/°C above +70°C)................................................ 840mW

Note 1: LX pin has internal clamps to GND and IN. These diodes may be forward biased during switching transitions. During these

transitions, the max LX current should be within the Max RMS Current rating for safe operation.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the

device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

Package Information

6 µDFN

Package Code

L622+1C

21-0164

90-0004

Outline Number

Land Pattern Number

Thermal Resistance, Four-Layer Board:

Junction to Ambient (θ

)

223.6°C/W

122°C/W

Junction to Case (θ

)

6 WLP

Package Code

N60E1+2

Outline Number

21-100128

Land Pattern Number

Thermal Resistance, Four-Layer Board:

Junction to Ambient (θ

Refer to Application Note 1891

)

95.15°C/W

For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages.

Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different

suffix character, but the drawing pertains to the package regardless of RoHS status.

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a

four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/

thermal-tutorial.

www.analog.com

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