MAX38640–MAX38643
Tiny 1.8V to 5.5V Input, 330nA I , 700mA
Q
nanoPower Buck Converter
Absolute Maximum Ratings
IN, EN, R
, NC, OUT to GND............................... -0.3V to +6V
Continuous Power Dissipation—µDFN (T = +70°C) (Derate
A
SEL
LX RMS Current WLP ............................. -1.6A
LX RMS Current µDFN.................................. -1A
LX to GND (Note 1)........................................-0.3V to V + 0.3V
to +1.6A
4.5mW/°C above +70°C) ...............................................357.8mW
Operating Temperature Range.............................-40°C to +85°C
Maximum Junction Temperature ......................................+150°C
Storage Temperature Range ..............................-65°C to +150°C
Lead Temperature (soldering, 10 seconds)......................+300°C
Soldering Temperature (reflow) ........................................+260°C
RMS
RMS
RMS
to +1A
RMS
IN
Continuous Power Dissipation—WLP (T = +70°C) (Derate
A
10.5mW/°C above +70°C)................................................ 840mW
Note 1: LX pin has internal clamps to GND and IN. These diodes may be forward biased during switching transitions. During these
transitions, the max LX current should be within the Max RMS Current rating for safe operation.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the
device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Package Information
6 µDFN
Package Code
L622+1C
21-0164
90-0004
Outline Number
Land Pattern Number
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θ
)
223.6°C/W
122°C/W
JA
Junction to Case (θ
)
JC
6 WLP
Package Code
N60E1+2
Outline Number
21-100128
Land Pattern Number
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θ
Refer to Application Note 1891
)
95.15°C/W
JA
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages.
Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different
suffix character, but the drawing pertains to the package regardless of RoHS status.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a
four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/
thermal-tutorial.
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