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MAX3765CUB PDF预览

MAX3765CUB

更新时间: 2024-01-03 19:14:14
品牌 Logo 应用领域
美信 - MAXIM 电信集成电路电信电路放大器光电二极管异步传输模式ATM
页数 文件大小 规格书
17页 345K
描述
3.0V to 5.5V, 1.25Gbps/2.5Gbps Limiting Amplifiers

MAX3765CUB 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:TSSOP
包装说明:EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10针数:10
Reach Compliance Code:not_compliantHTS代码:8542.39.00.01
风险等级:5.17JESD-30 代码:S-PDSO-G10
JESD-609代码:e0长度:3 mm
湿度敏感等级:1功能数量:1
端子数量:10最高工作温度:70 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:HTSSOP封装等效代码:TSSOP10,.19,20
封装形状:SQUARE封装形式:SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):245电源:3.3/5 V
认证状态:Not Qualified座面最大高度:1.1 mm
子类别:ATM/SONET/SDH ICs最大压摆率:0.076 mA
标称供电电压:3.3 V表面贴装:YES
技术:BIPOLAR电信集成电路类型:TELECOM CIRCUIT
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn85Pb15)
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:3 mmBase Number Matches:1

MAX3765CUB 数据手册

 浏览型号MAX3765CUB的Datasheet PDF文件第1页浏览型号MAX3765CUB的Datasheet PDF文件第3页浏览型号MAX3765CUB的Datasheet PDF文件第4页浏览型号MAX3765CUB的Datasheet PDF文件第5页浏览型号MAX3765CUB的Datasheet PDF文件第6页浏览型号MAX3765CUB的Datasheet PDF文件第7页 
+3 .0 V t o +5 .5 V, 1 .2 5 Gb p s /2 .5 Gb p s  
Lim it in g Am p lifie rs  
ABSOLUTE MAXIMUM RATINGS  
Supply Voltage (V ) ............................................-0.5V to +6.0V  
Continuous Current at PECL Outputs (OUT+, OUT-) .........50mA  
CC  
Voltage at IN+, IN- ..........................(V - 2.4V) to (V + 0.5V)  
Continuous Power Dissipation (T = +70°C)  
CC  
CC  
A
Voltage at SQUELCH, CAZ1,  
CAZ2, LOS, LOS, TH..................................-0.5V to (V + 0.5V)  
Voltage at LEVEL...................................................-0.5V to +2.0V  
Current into LOS, LOS ..........................................-1mA to +9mA  
Differential Input Voltage (IN+ - IN-) .....................................2.5V  
Continuous Current at  
16-Pin TSSOP (derate 27mW/°C above +70°C) .........2162mW  
10-Pin µMAX (derate 20mW/°C above +70°C) ...........1600mW  
Operating Ambient Temperature Range .............-40°C to +85°C  
Storage Temperature Range .............................-55°C to +150°C  
Processing Temperature (dice) .......................................+400°C  
Lead Temperature (soldering, 10s) .................................+300°C  
CC  
CML Outputs (OUT+, OUT-)..........................-25mA to +25mA  
Stresses beyond those listed under Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional  
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to  
absolute maximum rating conditions for extended periods may affect device reliability.  
ELECTRICAL CHARACTERISTICS  
(Data outputs terminated per Figure 1, V = +3.0V to +5.5V, T = 0°C to +70°C. Typical values are at V = +3.3V, T = +25°C,  
CC  
A
CC  
A
unless otherwise noted.) (Note 1)  
PARAMETER  
CONDITIONS  
MIN  
TYP  
1.25  
2.5  
MAX UNITS  
MAX3264/MAX3268/MAX3768  
MAX3265/MAX3269/MAX3765  
MAX3264/MAX3268/MAX3768  
MAX3265/MAX3269/MAX3765  
MAX3264/MAX3268/MAX3768 (Notes 2, 3)  
MAX3265/MAX3269/MAX3765 (Notes 2, 3)  
MAX3264/MAX3268/MAX3768 (Notes 2, 4)  
MAX3265/MAX3269/MAX3765 (Notes 2, 4)  
MAX3264 (Note 5)  
Data Rate  
Gbps  
5
1200  
mV  
Input Voltage Range  
Deterministic Jitter  
Random Jitter  
10  
1200  
14  
11  
30  
psp-p  
25  
15  
ps  
RMS  
8
80  
80  
175  
100  
150  
100  
4.4  
1
300  
150  
300  
150  
MAX3265/MAX3765 (Note 6)  
MAX3268/MAX3768 (Note 5)  
MAX3269 (Note 6)  
Data Output Edge Speed  
ps  
LOS Hysteresis  
(Notes 2, 7)  
2.5  
dB  
µs  
LOS Assert/Deassert Time  
(Notes 7, 8)  
MAX3264/MAX3268/MAX3768  
MAX3265/MAX3269/MAX3765  
MAX3264/MAX3268/MAX3768  
MAX3265/MAX3269/MAX3765  
1.20  
2.20  
2.6  
4.8  
4.5  
8.5  
Low LOS Assert Level  
R
R
= 2.5k  
= 2.5kΩ  
mV  
mV  
TH  
TH  
Low LOS Deassert Level  
2
_______________________________________________________________________________________  

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