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MAX3765CUB PDF预览

MAX3765CUB

更新时间: 2024-02-07 09:53:10
品牌 Logo 应用领域
美信 - MAXIM 电信集成电路电信电路放大器光电二极管异步传输模式ATM
页数 文件大小 规格书
17页 345K
描述
3.0V to 5.5V, 1.25Gbps/2.5Gbps Limiting Amplifiers

MAX3765CUB 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:TSSOP
包装说明:EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10针数:10
Reach Compliance Code:not_compliantHTS代码:8542.39.00.01
风险等级:5.17JESD-30 代码:S-PDSO-G10
JESD-609代码:e0长度:3 mm
湿度敏感等级:1功能数量:1
端子数量:10最高工作温度:70 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:HTSSOP封装等效代码:TSSOP10,.19,20
封装形状:SQUARE封装形式:SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):245电源:3.3/5 V
认证状态:Not Qualified座面最大高度:1.1 mm
子类别:ATM/SONET/SDH ICs最大压摆率:0.076 mA
标称供电电压:3.3 V表面贴装:YES
技术:BIPOLAR电信集成电路类型:TELECOM CIRCUIT
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn85Pb15)
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:3 mmBase Number Matches:1

MAX3765CUB 数据手册

 浏览型号MAX3765CUB的Datasheet PDF文件第11页浏览型号MAX3765CUB的Datasheet PDF文件第12页浏览型号MAX3765CUB的Datasheet PDF文件第13页浏览型号MAX3765CUB的Datasheet PDF文件第14页浏览型号MAX3765CUB的Datasheet PDF文件第15页浏览型号MAX3765CUB的Datasheet PDF文件第16页 
+3 .0 V t o +5 .5 V, 1 .2 5 Gb p s /2 .5 Gb p s  
Lim it in g Am p lifie rs  
P a c k a g e In fo rm a t io n (c o n t in u e d )  
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,  
go to www.maxim-ic.com/packages.)  
PACKAGE OUTLINE, TSSOP, 4.40 MM BODY  
EXPOSED PAD  
1
21-0108  
D
1
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are  
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.  
17 ____________________Ma x im In t e g ra t e d P ro d u c t s , 1 2 0 S a n Ga b rie l Drive , S u n n yva le , CA 9 4 0 8 6 4 0 8 -7 3 7 -7 6 0 0  
© 2004 Maxim Integrated Products  
Printed USA  
is a registered trademark of Maxim Integrated Products.  

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