MAX3222E/MAX3232E/
MAX3237E/MAX3241E/
MAX3246E
±15kV ESD-Protected, Down to 10nA,
3.0V to 5.5V, Up to 1Mbps,
True RS-232 Transceivers
Absolute Maximum Ratings
V
to GND ............................................................-0.3V to +6V
18-Pin PDIP (derate 11.11mW/°C above +70°C)........889mW
20-Pin TQFN (derate 21.3mW/°C above +70°C)......1702mW
20-Pin TSSOP (derate 10.9mW/°C above +70°C)......879mW
20-Pin SSOP (derate 8.00mW/°C above +70°C)........640mW
28-Pin SSOP (derate 9.52mW/°C above +70°C)........762mW
28-Pin Wide SO (derate 12.50mW/°C above +70°C) ........1W
28-Pin TSSOP (derate 12.8mW/°C above +70°C)....1026mW
32-Pin TQFN (derate 33.3mW/°C above +70°C)......2666mW
6 x 6 UCSP (derate 12.6mW/°C above +70°C) ........1010mW
Operating Temperature Ranges
CC
V+ to GND (Note 1).................................................-0.3V to +7V
V- to GND (Note 1)..................................................+0.3V to -7V
V+ + |V-| (Note 1) ................................................................+13V
Input Voltages
T_IN, EN, SHDN, MBAUD to GND .....................-0.3V to +6V
R_IN to GND ...................................................................±25V
Output Voltages
T_OUT to GND.............................................................±13.2V
R_OUT, R_OUTB
(MAX3237E/MAX3241E)...................... -0.3V to (V
Short-Circuit Duration, T_OUT to GND.....................Continuous
+ 0.3V)
MAX32_ _EC_ _.................................................0°C to +70°C
MAX32_ _EE_ _............................................. -40°C to +85°C
Storage Temperature Range............................ -65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow).......................................+260°C
Bump Reflow Temperature (Note 2)
CC
Continuous Power Dissipation (T = +70°C)
A
16-Pin SSOP (derate 7.14mW/°C above +70°C)........571mW
16-Pin TSSOP (derate 9.4mW/°C above +70°C).....754.7mW
16-Pin TQFN (derate 20.8mW/°C above +70°C)...1666.7mW
16-Pin Wide SO (derate 9.52mW/°C above +70°C) ...762mW
18-Pin Wide SO (derate 9.52mW/°C above +70°C) ...762mW
Infrared, 15s ................................................................+200°C
Vapor Phase, 20s ........................................................+215°C
Note 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.
Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom-
mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow.
Preheating is required. Hand or wave soldering is not allowed.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Electrical Characteristics
CC
(V
= +3V to +5.5V, C1–C4 = 0.1μF, T = T
to T
, unless otherwise noted. Typical values are at T = +25°C.) (Notes 3, 4)
MAX A
A
MIN
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
DC CHARACTERISTICS (V
= +3.3V or +5V, T = +25°C)
A
CC
MAX3222E, MAX3232E,
MAX3241E, MAX3246E
0.3
1
Supply Current
SHDN = V , no load
mA
CC
MAX3237E
0.5
1
2.0
10
SHDN = GND
µA
nA
Shutdown Supply Current
SHDN = R_IN = GND, T_IN = GND or V
(MAX3237E)
10
300
CC
LOGIC INPUTS
Input Logic Low
T_IN, EN, SHDN, MBAUD
0.8
V
V
V
V
V
= +3.3V
= +5.0V
2.0
2.4
CC
CC
Input Logic High
T_IN, EN, SHDN, MBAUD
Transmitter Input Hysteresis
0.5
±0.01
9
MAX3222E, MAX3232E,
MAX3241E, MAX3246E
T_IN, EN, SHDN
±1
18
Input Leakage Current
µA
T_IN, SHDN, MBAUD
MAX3237E (Note 5)
Maxim Integrated
│ 2
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