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MAX3222ECDWG4 PDF预览

MAX3222ECDWG4

更新时间: 2024-11-26 05:49:03
品牌 Logo 应用领域
德州仪器 - TI 线路驱动器或接收器驱动程序和接口接口集成电路光电二极管
页数 文件大小 规格书
17页 396K
描述
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION

MAX3222ECDWG4 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SOIC
包装说明:GREEN, PLASTIC, SOIC-20针数:20
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.21
Is Samacsys:N其他特性:ALSO OPERATES AT 5V SUPPLY
差分输出:NO驱动器位数:2
高电平输入电流最大值:0.000001 A输入特性:SCHMITT TRIGGER
接口集成电路类型:LINE TRANSCEIVER接口标准:EIA-232-F; TIA-232-F; V.28
JESD-30 代码:R-PDSO-G20JESD-609代码:e4
长度:12.8 mm湿度敏感等级:1
功能数量:2端子数量:20
最高工作温度:70 °C最低工作温度:
最小输出摆幅:10 V最大输出低电流:0.0016 A
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装等效代码:SOP20,.4封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
电源:3.3/5 V认证状态:Not Qualified
最大接收延迟:300 ns接收器位数:2
座面最大高度:2.65 mm子类别:Line Driver or Receivers
最大压摆率:1 mA最大供电电压:3.6 V
最小供电电压:3 V标称供电电压:3.3 V
表面贴装:YES温度等级:COMMERCIAL
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED最大传输延迟:300 ns
宽度:7.5 mmBase Number Matches:1

MAX3222ECDWG4 数据手册

 浏览型号MAX3222ECDWG4的Datasheet PDF文件第2页浏览型号MAX3222ECDWG4的Datasheet PDF文件第3页浏览型号MAX3222ECDWG4的Datasheet PDF文件第4页浏览型号MAX3222ECDWG4的Datasheet PDF文件第5页浏览型号MAX3222ECDWG4的Datasheet PDF文件第6页浏览型号MAX3222ECDWG4的Datasheet PDF文件第7页 
MAX3222E  
www.ti.com.......................................................................................................................................... SLLS708A JANUARY 2006REVISED SEPTEMBER 2009  
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER  
WITH ±15-kV ESD PROTECTION  
Check for Samples: MAX3222E  
The device meets the requirements of TIA/EIA-232-F  
and provides the electrical interface between an  
1
FEATURES  
ESD Protection for RS-232 Bus Pins  
asynchronous communication controller and the  
serial-port connector. The charge pump and four  
small external capacitors allow operation from a  
single 3-V to 5.5-V supply. The device operates at  
typical data signaling rates up to 500 kbit/s and a  
maximum of 30-V/μs driver output slew rate.  
±15-kV Human-Body Model (HBM)  
±8-kV IEC61000-4-2, Contact Discharge  
±15-kV IEC61000-4-2, Air-Gap Discharge  
Meets or Exceeds the Requirements of  
TIA/EIA-232-F and ITU v.28 Standards  
DB, DW, OR PW PACKAGE  
(TOP VIEW)  
Operates With 3-V to 5.5-V VCC Supply  
Operates up to 500 kbit/s  
Two Drivers and Two Receivers  
Low Standby Current . . . 1 μA Typ  
External Capacitors . . . 4 × 0.1 μF  
Accepts 5-V Logic Input With 3.3-V Supply  
EN  
C1+  
1
20 PWRDOWN  
2
19  
18  
17  
16  
15  
14  
13  
12  
11  
V
CC  
3
V+  
GND  
DOUT1  
RIN1  
ROUT1  
NC  
4
C1−  
5
C2+  
Alternative High-Speed Pin-Compatible Device  
(1 Mbit/s) for SNx5C3222E  
6
C2−  
7
V−  
8
DOUT2  
RIN2  
ROUT2  
DIN1  
DIN2  
NC  
APPLICATIONS  
9
Battery-Powered Systems  
PDAs  
Notebooks  
Laptops  
Palmtop PCs  
Hand-Held Equipment  
10  
NC − No internal connection  
DESCRIPTION/ORDERING INFORMATION  
The MAX3222E consists of two line drivers, two line  
receivers, and a dual charge-pump circuit with ±15-kV  
ESD protection pin to pin (serial-port connection pins,  
including GND).  
The MAX3222E can be placed in the power-down mode by setting the power-down (PWRDOWN) input low,  
which draws only 1 μA from the power supply. When the device is powered down, the receivers remain active  
while the drivers are placed in the high-impedance state. Also, during power down, the onboard charge pump is  
disabled; V+ is lowered to VCC, and V– is raised toward GND. Receiver outputs also can be placed in the  
high-impedance state by setting enable (EN) high.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2006–2009, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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