19-2754; Rev 2; 11/05
W-CDMA/W-TDD/TD-SCDMA Zero-IF Receivers
General Description
Features
♦ Fully Monolithic Direct-Conversion Receivers
The MAX2390–MAX2393/MAX2396/MAX2400/MAX2401
(referred to as the “MAX2390 family”) fully integrated
direct-conversion receiver ICs are designed for W-CDMA
and TD-SCDMA applications.
♦ Eliminate External IF SAW + IF AGC + I/Q Demod
♦ Meet all 3GPP Receiver’s Standard Requirements
with at Least 3dB Margin on Eb/No
The MAX2390 family of receiver ICs have over 90dB of
dynamic gain control, and typical noise figure of 2.7dB
referred to LNA input. Each receiver consists of an ultra-
low-current low-noise amplifier (LNA) with on-chip output
matching and a two-step gain control. The zero-IF
demodulator has a differential circuit topology for mini-
mum LO leakage to receiver’s input. The channel selec-
tivity is done completely in the baseband section of the
receiver with an on-chip lowpass filter. The AGC section
has over 50dB of gain-control range. LO quadrature
generation is done on-chip through a divide-by-2
prescaler. The DC offset cancellation in the I/Q baseband
channels is done fully on-chip using a DC servo loop. To
quickly correct for large DC offset transients in minimal
time, very fast settling time is obtained by optimization of
the DC-offset-cancellation circuit’s time constant.
♦ Operate from a +2.7V to +3.3V Single Supply
♦ Over 90dB of RF+ Baseband Gain-Control Range
♦ Channel Selectivity Over 40dB
♦ Receiver Current Consumption ≈ 32mA
♦ On-Chip DC Offset Cancellation
♦ Compatible with Various CMOS Logic Levels
Pin Configurations/
Functional Diagrams
28
27
26
25
24
23
22
SERIAL
INTERFACE
V
1
2
3
4
5
6
7
21 Q-
CC
The MAX2390 family includes a 3-wire serial bus for con-
figuring the different receiver modes. They also include a
SHDN pin for full device shutdown. The receivers are
fabricated using an advanced high-frequency SiGe
BiCMOS process. The ICs operate from a single +2.7V to
+3.3V supply and are housed in a small 28-pin leadless
QFN-EP and thin QFN-EP packages (5mm x 5mm).
RF+
RF-
20
Q+
19 AGC
BIAS
18 SHDN
V
CC
LD
17
16
15
MAX2390–MAX2393/
MAX2401
/2
G_LNA
REFIN
Applications
INTEGER-N
PLL
TANK
12
LNA_OUT
LNA
V
CC
IMT2000 Handsets
UMTS Handsets
TD-SCDMA Handsets
W-CDMA TDD Handsets
8
9
10
11
13
14
W-CDMA Band II (PCS)
Handsets
W-CDMA Band III (DCS)
Handsets
Pin Configurations continued at end of data sheet.
Ordering Information/Selector Guide
PART
TEMP RANGE
PIN-PACKAGE
-40°C to +85°C 28 Thin QFN-EP*
-40°C to +85°C 28 Thin QFN-EP*
APPLICATION
CHIP RATE (Mcps) RF BAND (MHz) SYNTHESIZER
W-CDMA Band II
MAX2390ETI
MAX2391ETI
3.84
3.84
1930 to 1990
2110 to 2170
2110 to 2170
2010 to 2025
2010 to 2025
1900 to 1920
2110 to 2170
1930 to 1990
1805 to 1880
1805 to 1880
On-Chip
On-Chip
On-Chip
On-Chip
On-Chip
On-Chip
External
External
On-Chip
On-Chip
IMT2000/UMTS
IMT2000/UMTS
TD-SCDMA
MAX2391ETI+ -40°C to +85°C 28 Thin QFN-EP*
MAX2392ETI -40°C to +85°C 28 Thin QFN-EP*
MAX2392ETI+ -40°C to +85°C 28 Thin QFN-EP*
3.84
1.28
TD-SCDMA
1.28
MAX2393EGI -40°C to +85°C
MAX2396EGI -40°C to +85°C
28 QFN-EP*
28 QFN-EP*
W-TDD/TD-SCDMA
IMT2000/UMTS
W-CDMA Band II
W-CDMA Band III
W-CDMA Band III
3.84 or 1.28
3.84
MAX2400ETI
MAX2401ETI
-40°C to +85°C 28 Thin QFN-EP*
-40°C to +85°C 28 Thin QFN-EP*
3.84
3.84
MAX2401ETI+ -40°C to +85°C 28 Thin QFN-EP*
2.84
*EP = Exposed paddle. + Denotes lead-free package.
________________________________________________________________ Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
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