Datasheet > MA734

MA734

更新时间： 2024-04-09 19:02:35

品牌	Logo	应用领域
芯源 - MPS		传感器
页数	文件大小	规格书
29页	1636K
描述
8 位至 12.5 位、3μs 低延迟非接触式角度传感器

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MA734 数据手册

MA734 – 8-BIT TO 12.5-BIT DIGITAL ANGLE SENSOR

PIN FUNCTIONS

Pin #

Name

Description

Interrupt on angle change. Output. Indicates that the angle change has exceeded the

defined threshold.

IRQ

Error flag. This pin is an active high output.

ERR

NVM

Non-volatile memory (NVM). This pin is an output that indicates that the chip is busy

accessing the NVM.

MOSI

/CS

Data in (SPI). This pin is an internal pull-down resistor input.

Chip select (SPI). This pin is an internal, active low, pull-down resistor input.

No connection. This pin is not internally connected.

Data out (SPI). This pin is an output, and is pulled down when /CS is logic 1 (i.e. SPI is

inactive).

MISO

GND

Supply ground.

No connection. This pin is not internally connected..

Factory use only. Connect TEST to ground.

Digital output indicating field strength below MGLT level. Output.

Clock (SPI). This pin is an internal pull-down resistor input.

3.3V supply.

TEST

MGL

SCLK

VDD

No connection. This pin is not internally connected.

Digital output. This pin is an output that indicates the field strength above the MGHT

level.

MGH

Recommended not to solder. Leave this pin floating.

Exposed pad

Thermal Resistance ⁽³⁾

QFN-16 (3mmx3mm)............. 50....... 12... °C/W

θ_JA

θ_JC

(1)

ABSOLUTE MAXIMUM RATINGS

Supply voltage .............................-0.5V to +4.6V

Input pin voltage (V_I).......................-0.5V to +6V

Output pin voltage (V_O)................-0.5V to +4.6V

Continuous power dissipation (T_A= 25°C) ⁽²⁾

...................................................................... 2W

Junction temperature ................................150°C

Lead temperature .....................................260°C

Storage temperature................ -65°C to +150°C

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature T_J(MAX), the junction-to-

ambient thermal resistance θ_JA, and the ambient temperature

T_A. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by P_D(MAX) = (T_J

(MAX) - T_A) / θ_JA.

3) Measured on JESD51-7, 4-layer PCB.

ESD Ratings

Human body model (HBM) .......................... 2kV

Charged device model (CDM) ..................... 2kV

MA734 Rev. 1.0

5/27/2021

MonolithicPower.com

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

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