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M1AGL1000V5-FFG144 PDF预览

M1AGL1000V5-FFG144

更新时间: 2024-01-24 04:19:46
品牌 Logo 应用领域
美高森美 - MICROSEMI 时钟可编程逻辑
页数 文件大小 规格书
178页 5602K
描述
Field Programmable Gate Array, 24576 CLBs, 1000000 Gates, 108MHz, 24576-Cell, CMOS, PBGA144, 13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

M1AGL1000V5-FFG144 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:LBGA, BGA144,12X12,40Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.88
最大时钟频率:108 MHzJESD-30 代码:S-PBGA-B144
JESD-609代码:e0长度:13 mm
湿度敏感等级:3可配置逻辑块数量:24576
等效关口数量:1000000输入次数:97
逻辑单元数量:24576输出次数:97
端子数量:144最高工作温度:70 °C
最低工作温度:组织:24576 CLBS, 1000000 GATES
封装主体材料:PLASTIC/EPOXY封装代码:LBGA
封装等效代码:BGA144,12X12,40封装形状:SQUARE
封装形式:GRID ARRAY, LOW PROFILE峰值回流温度(摄氏度):225
电源:1.5 V可编程逻辑类型:FIELD PROGRAMMABLE GATE ARRAY
认证状态:Not Qualified座面最大高度:1.55 mm
子类别:Field Programmable Gate Arrays最大供电电压:1.575 V
最小供电电压:1.425 V标称供电电压:1.5 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:TIN LEAD SILVER
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:30
宽度:13 mmBase Number Matches:1

M1AGL1000V5-FFG144 数据手册

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Product Brief  
®
1 – IGLOO Low-Power Flash FPGAs  
with Flash*Freeze Technology  
Advanced I/O  
Features and Benefits  
• 700 Mbps DDR, LVDS-Capable I/Os (AGL250 and above)  
• 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage  
Operation  
Low Power  
• 1.2 V or 1.5 V Core and I/O Voltage for Low Power  
• Supports Single-Voltage System Operation  
• 5 µW Power Consumption in Flash*Freeze Mode  
• Low-Power Active FPGA Operation  
• Flash*Freeze Technology Enables Ultra-Low Power  
Consumption while Maintaining FPGA Content  
• Easy Entry to / Exit from Ultra-Low-Power  
Flash*Freeze Mode  
• Bank-Selectable I/O Voltages—up to 4 Banks per Chip  
• Single-Ended I/O Standards: LVTTL, LVCMOS  
3.3 V / 2.5 V / 1.8 V / 1.5 V / 1.2 V, 3.3 V PCI / 3.3 V  
PCI-X , and LVCMOS 2.5 V / 5.0 V Input  
• Differential I/O Standards: LVPECL, LVDS, BLVDS, and  
M-LVDS (AGL250 and above)  
• I/O Registers on Input, Output, and Enable Paths  
• Hot-Swappable and Cold-Sparing I/Os  
High Capacity  
• Programmable Output Slew Rate and Drive Strength  
• 15 k to 1 Million System Gates  
• Up to 144 kbits of True Dual-Port SRAM  
• Up to 300 User I/Os  
• Weak Pull-Up/-Down  
• IEEE 1149.1 (JTAG) Boundary Scan Test  
• Pin-Compatible Packages across the IGLOO Family  
Reprogrammable Flash Technology  
• 130-nm, 7-Layer Metal, Flash-Based CMOS Process  
• Live-at-Power-Up (LAPU) Level 0 Support  
• Single-Chip Solution  
Clock Conditioning Circuit (CCC) and PLL†  
• Six CCC Blocks, One with an Integrated PLL  
• Configurable Phase Shift, Multiply/Divide, Delay  
Capabilities, and External Feedback  
• Retains Programmed Design When Powered Off  
• Wide Input Frequency Range (1.5 MHz up to 250 MHz)  
In-System Programming (ISP) and Security  
Embedded Memory  
• Secure ISP Using On-Chip 128-Bit Advanced  
®
Encryption Standard (AES) Decryption (except ARM -  
• 1 kbit of FlashROM User Nonvolatile Memory  
®
enabled IGLOO  
devices) via JTAG (IEEE 1532–  
• SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit  
compliant)  
RAM Blocks (×1, ×2, ×4, ×9, and ×18 organizations)  
®
to Secure FPGA Contents  
HighFla-PsheLrofcokrmance Routing Hierarchy  
ARMTruPerDoucael-sPsoortrSSRAuMpp(eoxrctepitn×I1G8)LOO FPGAs  
• M1 IGLOO Devices—Cortex™-M1 Soft Processor  
Available with or without Debug  
• Segmented, Hierarchical Routing and Clock Structure  
Table 1-1 • IGLOO Product Family  
IGLOO Devices  
AGL015  
AGL030  
AGL060 AGL125 AGL250  
AGL600  
AGL1000  
ARM-Enabled IGLOO Devices  
System Gates  
M1AGL250 M1AGL600 M1AGL1000  
15 k  
128  
384  
5
30 k  
256  
768  
5
60 k  
512  
1,536  
10  
125 k  
1,024  
3,072  
16  
250 k  
600 k  
1 M  
Typical Equivalent Macrocells  
VersaTiles (D-flip-flops)  
Flash*Freeze Mode (typical, µW)  
RAM kbits (1,024 bits)  
4,608-Bit Blocks  
6,144  
24  
13,824  
36  
24,576  
53  
18  
36  
36  
108  
24  
144  
32  
4
8
8
FlashROM Bits  
1 k  
1 k  
1 k  
Yes  
1
1 k  
Yes  
1
1 k  
Yes  
1
1 k  
Yes  
1
1 k  
Yes  
1
4
Secure (AES) ISP  
Integrated PLL in CCCs  
1
VersaNet Globals  
6
6
18  
18  
18  
18  
18  
I/O Banks  
2
2
2
2
4
4
4
Maximum User I/Os  
49  
81  
96  
133  
143  
235  
300  
Package Pins  
CS  
5
3,5  
UC81, CS81  
QN132  
VQ100  
CS121  
CS196  
CS196  
CS281  
CS281  
3
QFN  
QN68  
QN132  
QN132 QN132  
VQFP  
FBGA  
VQ100 VQ100  
VQ100  
FG144  
3
FG144  
FG144  
FG144,  
FG256,  
FG484  
FG144,  
FG256,  
FG484  
Notes:  
1. Six chip (main) and twelve quadrant global networks are available for AGL060 and above.  
2. For higher densities and support of additional features, refer to the IGLOOe Low-Power Flash FPGAs with  
Flash*Freeze Technology handbook.  
3. Device/package support TBD.  
4. AES is not available for ARM-enabled IGLOO devices.  
5. The M1AGL250 device does not support this package.  
AGL015 and AGL030 devices do not support this feature.  
Supported only by AGL015 and AGL030 devices.  
March 2008  
Product Brief  
1-1  
© 2008 Actel Corporation  

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Field Programmable Gate Array, 24576 CLBs, 1000000 Gates, 108MHz, 24576-Cell, CMOS, PBGA25
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M1AGL1000V5-FFGG144 ACTEL

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Field Programmable Gate Array, 24576 CLBs, 1000000 Gates, 108MHz, CMOS, PBGA144, 13 X 13 M
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M1AGL1000V5-FG484 MICROSEMI

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Field Programmable Gate Array, 24576 CLBs, 1000000 Gates, 108MHz, CMOS, PBGA484, 23 X 23 M
M1AGL1000V5-FG484I MICROSEMI

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Field Programmable Gate Array, 24576 CLBs, 1000000 Gates, 108MHz, CMOS, PBGA484, 23 X 23 M
M1AGL1000V5-FGG144I MICROSEMI

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Field Programmable Gate Array, 24576 CLBs, 1000000 Gates, 108MHz, CMOS, PBGA144, 13 X 13 M