是否Rohs认证: | 不符合 | 生命周期: | Transferred |
零件包装代码: | DFN | 包装说明: | HVSON, SOLCC6,.08,20 |
针数: | 6 | Reach Compliance Code: | not_compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.39.00.01 |
风险等级: | 5.16 | 可调阈值: | NO |
模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT | JESD-30 代码: | S-PDSO-N6 |
JESD-609代码: | e0 | 长度: | 2 mm |
湿度敏感等级: | 1 | 信道数量: | 1 |
功能数量: | 1 | 端子数量: | 6 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | HVSON |
封装等效代码: | SOLCC6,.08,20 | 封装形状: | SQUARE |
封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 峰值回流温度(摄氏度): | 235 |
认证状态: | Not Qualified | 座面最大高度: | 0.8 mm |
最大供电电流 (Isup): | 0.06 mA | 最大供电电压 (Vsup): | 8 V |
最小供电电压 (Vsup): | 3.75 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | NO LEAD | 端子节距: | 0.5 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 20 |
宽度: | 2 mm | Base Number Matches: | 1 |
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暂无描述 |