LMV821-Q1 is Obsolete
LMV821-Q1
LMV822-Q1
LMV824-Q1
www.ti.com
SLOS461F –MARCH 2005–REVISED JULY 2010
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
Check for Samples: LMV821-Q1, LMV822-Q1, LMV824-Q1
The LMV82x devices are characterized for operation
from –40°C to 125°C.
1
FEATURES
•
•
•
•
•
Qualified for Automotive Applications
2.5-V, 2.7-V, and 5-V Performance
–40°C to 125°C Operation
LMV821...DBV PACKAGE
(TOP VIEW)
No Crossover Distortion
1
2
3
5
4
IN+
GND/VCC-
IN-
VCC+
Low Supply Current at VCC+ = 5 V
–
–
–
LMV821: 0.3 mA Typ
LMV822: 0.5 mA Typ
LMV824: 1 mA Typ
OUT
•
•
•
Rail-to-Rail Output Swing
LMV822...DGK PACKAGE
(TOP VIEW)
Gain Bandwidth of 5.5 MHz Typ at 5 V
Slew Rate of 1.9 V/µs Typ at 5 V
1OUT
1IN-
VCC+
1
2
3
4
8
7
6
5
2OUT
2IN -
2IN+
DESCRIPTION/ORDERING INFORMATION
1IN+
The LMV821 single, LMV822 dual, and LMV824 quad
devices are low-voltage (2.5 V to 5.5 V), low-power
GND/VCC-
commodity
operational
amplifiers.
Electrical
LMV824...D OR PW PACKAGE
(TOP VIEW)
characteristics are very similar to the LMV3xx
operational amplifiers (low supply current, rail-to-rail
outputs, input common-mode range that includes
ground). However, the LMV82x devices offer a higher
bandwidth (5.5 MHz typical) and faster slew rate
(1.9 V/µs typical).
1OUT
1
2
3
4
5
6
7
14 4OUT
1IN-
1IN+
VCC+
4IN–
13
12
11
10
9
4IN+
GND/VCC-
3IN+
The LMV82x devices are cost-effective solutions for
applications
2IN+
2IN-
requiring
low-voltage/low-power
operation and space-saving considerations. The
LMV821 saves space on printed circuit boards and
enables the design of small portable electronic
devices (cordless and cellular phones, laptops, PDAs,
PCMIA). It also allows the designer to place the
device closer to the signal source to reduce noise
pickup and increase signal integrity.
3IN–
2OUT
3OUT
8
ORDERING INFORMATION(1)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
LMV821QDBVRQ1
LMV822QDGKRQ1
LMV824QDRQ1
TOP-SIDE MARKING(3)
Single
Dual
SOT-23 – DBV
Reel of 3000
Reel of 2500
Reel of 2500
Reel of 2000
RB1_
MSOP/VSSOP – DGK
SOIC – D
R8B
–40°C to 125°C
LMV824Q
MV824Q
Quad
TSSOP – PW
LMV824QPWRQ1
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) DBV: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005–2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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