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LMV242_15 PDF预览

LMV242_15

更新时间: 2024-02-08 05:25:02
品牌 Logo 应用领域
德州仪器 - TI GSM
页数 文件大小 规格书
25页 1009K
描述
LMV242 Dual Output, Quad-Band GSM/GPRS Power Amplifier Controller

LMV242_15 数据手册

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LMV242  
www.ti.com  
SNWS014C APRIL 2004REVISED MAY 2013  
LMV242 Dual Output, Quad-Band GSM/GPRS Power Amplifier Controller  
Check for Samples: LMV242  
1
FEATURES  
DESCRIPTION  
The LMV242 is a power amplifier (PA) controller  
intended for use within an RF transmit power control  
loop in GSM/GPRS mobile phones. The LMV242  
supports all single-supply PA’s including InGaP, HBT  
and bipolar power amplifiers. The device operates  
with a single supply from 2.6V to 5.5V.  
2
Support of InGaP HBT, Bipolar Technology  
Quad-Band Operation  
Shutdown Mode for Power Save in RX Slot  
Integrated Ramp Filter  
50 dB RF Detector  
Included in the PA controller are an RF detector, a  
ramp filter and two selectable output drivers that  
function as error amplifiers for two different bands.  
The LMV242 input interface consists two analog and  
two digital inputs. The analog inputs are the RF input,  
Ramp voltage input. The digital inputs perform the  
function of “Band Select” and “Shutdown/Transmit  
Enable” respectively. The “Band Select” function  
enables either of two outputs, namely OUT1 when BS  
= High, or output OUT2 when BS = Low. The output  
that is not enabled is pulled low to the minimum  
output voltage. The LMV242 is active in the case  
TX_EN = High. When TX_EN = Low the device is in  
a low power consumption shutdown mode. During  
shutdown both outputs will be pulled low to the  
minimum output voltage. Individual PA characteristics  
are accommodated by a user selectable external RC  
combination.  
GPRS Compliant  
External Loop Compensation Option  
Accurate Temperature Compensation  
WSON Package 3x3 mm and Fully Tested Die  
Sales  
APPLICATIONS  
GSM/GPRS/TDMA/TD_SCDMA Mobile Phone  
Pulse RF Control  
Wireless LAN  
GSM/GPRS Power Amplifier Module  
Transmit Module  
The LMV242 is offered in fully tested die form as well  
as in a 10-lead WSON package and is therefore  
especially suitable for small footprint PA module  
solutions.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
All trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2004–2013, Texas Instruments Incorporated  

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