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LMR06C PDF预览

LMR06C

更新时间: 2024-01-28 04:18:56
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固锝 - GOOD-ARK /
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描述
Low Profile Miniature Single Phase Surface Mount Bridge Rectifiers

LMR06C 数据手册

 浏览型号LMR06C的Datasheet PDF文件第2页浏览型号LMR06C的Datasheet PDF文件第3页浏览型号LMR06C的Datasheet PDF文件第4页 
LMR02C thru LMR10C  
Low Profile Miniature Single Phase Surface Mount Bridge Rectifiers  
Reverse Voltage 200~1000V Output Current 1.5A  
Features  
• Glass passivated Fast Recovery bridge rectifiers  
• Ideal for automated placement  
• Low forward voltage drop  
• Low leakage current  
• Moisture sensitivity: level 1, per J-STD-020  
• Solder dip 260 °C, 10 s  
• Low profileMax Height 1.30mm  
LPMB  
Typical Applications  
For use of general purpose AC to DC bridge rectification in power supplychargeroffice appliance,  
home appliance and telecome device.  
Maximum Ratings (TA = 25 °C unless otherwise noted)  
LMR02C  
LMR04C  
LMR06C  
LMR08C  
LMR10C  
Unit  
Parameter  
Symbol  
Maximum repetitive peak reverse voltage  
Maximum RMS voltage  
Maximum DC blocking voltage  
200  
140  
200  
400  
280  
400  
600  
420  
800  
560  
800  
1000  
700  
V
V
V
VRRM  
VRMS  
VDC  
600  
0.75 (1)  
1.5 (2)  
50  
1000  
A
Maximum average output rectified current  
Io(AV)  
Peak forward surge current 8.3 ms single half sine-  
wave superimposed on rated load  
A
IFSM  
I2t  
A2sec  
°C  
10.0  
Rating for fusing(t<8.3ms)  
TJ,  
TSTG  
- 55 to + 150  
Operating junction and storage temperature range  
Electrical Characteristics (TA = 25 °C unless otherwise noted)  
LMR02C  
LMR04C  
LMR06C  
LMR08C  
LMR10C  
Unit  
Parameter  
Test Conditions  
Symbol  
Maximum instantaneous  
forward voltage  
1.3  
VF  
Volts  
IF=0.75A, TA=25  
TA=25℃  
5
Maximum DC reverse current  
at rated DC blocking voltage  
IR  
µA  
TA=125℃  
100  
IF=0.5A,IR=1.0A,  
Irr=0.25A  
trr  
150  
250  
20  
500  
nS  
pF  
Typical reverse recovery time  
CJ  
Typical junction capacitance 4.0 V, 1 MHz  
Thermal Characteristics  
LMR02C  
LMR04C  
LMR06C  
LMR08C  
LMR10C  
Unit  
Parameter  
Symbol  
(1)  
60  
50  
20  
RθJA  
(2)  
Typical thermal resistance  
/W  
RθJA  
(1)  
RθJC  
Notes:  
1. On glass epoxy PCB, mounted on 1.3*1.3mm solder pads  
2. On 20*20mm aluminum substrate PCB with 1.3*1.3mm solder pads  
www.goodark.com  
1/4  
2016.09-Rev.B  

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