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LMR10

更新时间: 2024-02-03 23:14:53
品牌 Logo 应用领域
固锝 - GOOD-ARK /
页数 文件大小 规格书
4页 366K
描述
Low Profile Miniature Single Phase Surface Mount Bridge Rectifiers

LMR10 数据手册

 浏览型号LMR10的Datasheet PDF文件第2页浏览型号LMR10的Datasheet PDF文件第3页浏览型号LMR10的Datasheet PDF文件第4页 
LMR02 thru LMR10  
Low Profile Miniature Single Phase Surface Mount Bridge Rectifiers  
Reverse Voltage 200~1000V Output Current 1.0  
Features  
• Glass passivated Fast Recovery bridge rectifiers  
• Ideal for automated placement  
• Low forward voltage drop  
• Low leakage current  
• Moisture sensitivity: level 1, per J-STD-020  
• Solder dip 260 °C, 10 s  
• Low profileMax Height 1.30mm  
LPMB  
Typical Applications  
For use of general purpose AC to DC bridge rectification in power supplychargeroffice appliance,  
home appliance and telecome device.  
Maximum Ratings (TA = 25 °C unless otherwise noted)  
LMR02  
LMR04  
LMR06  
LMR08  
LMR10  
Unit  
Parameter  
Symbol  
Maximum repetitive peak reverse voltage  
Maximum RMS voltage  
Maximum DC blocking voltage  
200  
140  
200  
400  
280  
400  
600  
420  
600  
0.5 (1)  
1.0 (2)  
800  
560  
800  
1000  
700  
V
V
V
VRRM  
VRMS  
VDC  
1000  
A
Maximum average output rectified current  
Io(AV)  
Peak forward surge current 8.3 ms single half  
sine-wave superimposed on rated load  
30  
A
IFSM  
I2t  
A2sec  
°C  
3.8  
Rating for fusing(t<8.3ms)  
Operating junction and storage temperature  
range  
TJ,  
TSTG  
- 55 to + 150  
Electrical Characteristics (TA = 25 °C unless otherwise noted)  
LMR02  
LMR04  
LMR06  
LMR08  
LMR10  
Unit  
Parameter  
Test Conditions  
Symbol  
Maximum instantaneous  
forward voltage  
1.3  
VF  
Volts  
IF=0.5 A, TA=25  
TA=25℃  
Maximum DC reverse  
current at rated DC  
blocking voltage  
5
IR  
µA  
TA=125℃  
100  
IF=0.5A,IR=1.0A,  
Irr=0.25A  
Typical reverse recovery  
time  
trr  
150  
250  
15  
500  
nS  
pF  
Typical junction  
capacitance  
CJ  
4.0 V, 1 MHz  
Thermal Characteristics  
LMR02  
LMR04  
LMR06  
LMR08  
LMR10  
Unit  
Parameter  
Symbol  
(1)  
60  
50  
20  
RθJA  
(2)  
Typical thermal resistance  
/W  
RθJA  
(1)  
RθJC  
Notes:  
1. On glass epoxy PCB, mounted on 1.3*1.3mm solder pads  
2. On 20*20mm aluminum substrate PCB with 1.3*1.3mm solder pads  
www.goodark.com  
1/4  
2016.09-Rev.A  

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