LM5166
ZHCSFV4B –DECEMBER 2016–REVISED JUNE 2017
www.ti.com.cn
6 Specifications
6.1 Absolute Maximum Ratings
Over the recommended operating junction temperature range of –40°C to 150°C (unless otherwise noted).(1)(2)
MIN
–0.3
–0.7
–3
MAX
68
UNIT
VIN, EN to GND
SW to GND
V
VVIN + 0.3
V
20-ns transient
PGOOD, VOUT(3) to GND
HYS to GND
ILIM, SS, RT, FB(4) to GND
Maximum junction temperature, TJ
Storage temperature, Tstg
–0.3
–0.3
–0.3
–40
–55
16
7
V
V
3.6
150
150
V
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Fixed output setting.
(4) Adjustable output setting.
6.2 ESD Ratings
VALUE
±2000
±1000
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged device model (CDM), per JEDEC specification JESD22-C101(2)
V(ESD)
Electrostatic discharge
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
Over the recommended operating junction temperature range of –40°C to 150°C (unless otherwise noted).(1)
MIN
3
NOM
MAX
65
UNIT
VIN
EN
–0.3
–0.3
–0.3
0
65
Input voltages
V
PGOOD
12
HYS
5.5
500
150
Output current
Temperature
IOUT
mA
°C
Operating junction temperature
–40
(1) Operating Ratings are conditions under which the device is intended to be functional. For specifications and test conditions, see
Electrical Characteristics.
6.4 Thermal Information
LM5166
THERMAL METRIC(1)
DRC (VSON)
10 PINS
49.1
UNIT
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
57.2
26.6
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.8
ψJB
23.8
RθJC(bot)
4.8
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
4
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