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LM4867MT PDF预览

LM4867MT

更新时间: 2024-02-26 21:54:05
品牌 Logo 应用领域
美国国家半导体 - NSC 商用集成电路电容器音频放大器
页数 文件大小 规格书
26页 765K
描述
Output-Transient-Free Dual 2.1W Audio Amplifier Plus No Coupling Capacitor Stereo Headphone Function

LM4867MT 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:TSSOP
包装说明:TSSOP,针数:20
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.33.00.01风险等级:5.82
标称带宽:20 kHz商用集成电路类型:AUDIO AMPLIFIER
JESD-30 代码:R-PDSO-G20JESD-609代码:e3
长度:6.5 mm湿度敏感等级:1
信道数量:2功能数量:1
端子数量:20最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH峰值回流温度(摄氏度):260
认证状态:Not Qualified座面最大高度:1.2 mm
最大压摆率:15 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):2 V表面贴装:YES
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn)
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL处于峰值回流温度下的最长时间:40
宽度:4.4 mm

LM4867MT 数据手册

 浏览型号LM4867MT的Datasheet PDF文件第1页浏览型号LM4867MT的Datasheet PDF文件第2页浏览型号LM4867MT的Datasheet PDF文件第3页浏览型号LM4867MT的Datasheet PDF文件第5页浏览型号LM4867MT的Datasheet PDF文件第6页浏览型号LM4867MT的Datasheet PDF文件第7页 
Electrical Characteristics for Bridged-Mode Operation (Notes 3, 13) (Continued)  
The following specifications apply for VDD= 5V unless otherwise specified. Limits apply for TA= 25˚C.  
Symbol  
Parameter  
Conditions  
LM4867  
Typical Limit  
Units  
(Limits)  
(Note 14) (Note 15)  
THD+N Total Harmonic Distortion+Noise 20Hz f 20kHz, AVD = 2  
LM4867MTE, RL = 4, PO = 2W  
0.3  
0.3  
0.3  
%
%
%
LM4867LQ, RL = 4, PO = 2W  
LM4867, RL = 8, PO = 1W  
PSRR  
Power Supply Rejection Ratio  
VDD = 5V, VRIPPLE = 200 mVRMS, RL = 8,  
67  
dB  
CB = 2.2µF  
XTALK  
SNR  
Channel Separation  
f = 1 kHz, CB = 2.2µF  
80  
97  
dB  
dB  
Signal To Noise Ratio  
VDD = 5V, PO = 1.1W, RL = 8Ω  
Electrical Characteristics for Single-Ended Operation (Notes 3, 13)  
The following specifications apply for VDD= 5V unless otherwise specified. Limits apply for TA= 25˚C.  
Symbol  
Parameter  
Conditions  
LM4867  
Units  
(Limits)  
Typical  
Limit  
(Note 15)  
50  
(Note 14)  
VOS  
PO  
Output Offset Voltage  
Output Power  
VIN = 0V  
5
mV (max)  
mW (min)  
mW  
THD = 0.5%, f = 1kHz, RL = 32Ω  
85  
75  
THD+N = 1%, f = 1kHz, RL = 8(Note  
180  
20)  
THD+N = 1%, f = 1kHz, RL = 16Ω  
THD+N = 10%, f = 1kHz, RL = 32Ω  
THD+N = 10%, f = 1kHz, RL = 16Ω  
THD+N = 10%, f = 1kHz, RL = 32Ω  
165  
88  
208  
114  
mW  
mW  
mW  
mW  
VOUT  
Output Voltage Swing  
THD = 0.05%, RL = 5kΩ  
1
VP-P  
%
THD+N  
Total Harmonic Distortion+Noise  
AV = −1, PO = 75mW, 20 Hz f 20kHz,  
RL = 32Ω  
0.2  
PSRR  
Power Supply Rejection Ratio  
CB = 2.2µF, VRIPPLE = 200mVRMS  
f = 1kHz  
,
52  
dB  
XTALK  
SNR  
Channel Separation  
f = 1kHz, CB = 2.2µF  
60  
94  
dB  
dB  
Signal To Noise Ratio  
VDD = 5V, PO = 340mW, RL = 8Ω  
Note 3: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is  
functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which  
guarantee specific performance limits. This assumes that the device operates within the Operating Ratings. Specifications are not guaranteed for parameters where  
no limit is given. The typical value however, is a good indication of device performance.  
Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by T  
, θ , and the ambient temperature T . The maximum  
JA A  
JMAX  
allowable power dissipation is P  
= (T  
− T )/θ . For the LM4867, T  
= 150˚C. For the θ s for different packages, please see the Application  
DMAX  
JMAX  
A
JA  
JMAX  
JA  
Information section or the Absolute Maximum Ratings section.  
Note 5: Human body model, 100 pF discharged through a 1.5 kresistor.  
Note 6: Machine model, 220 pF–240 pF discharged through all pins.  
2
Note 7: The given θ is for an LM4867 packaged in an MXA20A with the Exposed-DAP soldered to an exposed 2in area of 1oz printed circuit board copper.  
JA  
2
Note 8: The given θ is for an LM4867 packaged in an MXA20A with the Exposed-DAP soldered to an exposed 1in area of 1oz printed circuit board copper.  
JA  
Note 9: The given θ is for an LM4867 packaged in an MXA20A with the Exposed-DAP not soldered to printed circuit board copper.  
JA  
2
Note 10: The given θ is for an LM4867 packaged in an LQA24A with the Exposed-DAP soldered to an exposed 2in area of 1oz printed circuit board copper.  
JA  
2
Note 11: The given θ is for an LM4867 packaged in an LQA24A with the Exposed-DAP soldered to an exposed 1in area of 1oz printed circuit board copper.  
JA  
Note 12: The given θ is for an LM4867 packaged in an LQA24A with the Exposed-DAP not soldered to printed circuit board copper.  
JA  
Note 13: All voltages are measured with respect to the ground (GND) pins, unless otherwise specified.  
Note 14: Typicals are measured at 25˚C and represent the parametric norm.  
Note 15: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level). Datasheet min/max specification limits are guaranteed by design, test, or  
statistical analysis.  
Note 16: The quiescent power supply current depends on the offset voltage when a practical load is connected to the amplifier.  
Note 17: Output power is measured at the device terminals.  
Note 18: When driving 3loads from a 5V supply, the LM4867LQ, LM4867MTE, or LM4867MTE-1 must be mounted to the circuit board and forced-air cooled (450  
linear-feet per minute).  
Note 19: When driving 4loads from a 5V supply, the LM4867LQ, LM4867MTE or LM4867MTE-1 must be mounted to the circuit board.  
www.national.com  
4

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