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LM2576S-12 PDF预览

LM2576S-12

更新时间： 2024-01-05 20:35:53
品牌 Logo 应用领域
德州仪器 - TI 稳压器开关式稳压器或控制器电源电路开关式控制器
页数 文件大小 规格书
37页 3998K
描述
SIMPLE SWITCHER® 3A Step-Down Voltage Regulator

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LM2576S-12 技术参数

是否无铅： 含铅是否Rohs认证： 不符合
生命周期：Obsolete零件包装代码：D2PAK
包装说明：TO-263, 5 PIN针数：4
Reach Compliance Code：unknownECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：5.69
Is Samacsys：N模拟集成电路 - 其他类型：SWITCHING REGULATOR
控制模式：VOLTAGE-MODE控制技术：PULSE WIDTH MODULATION
最大输入电压：40 V最小输入电压：4 V
标称输入电压：25 VJESD-30 代码：R-PSSO-G5
JESD-609代码：e0长度：9.97 mm
功能数量：1端子数量：5
最高工作温度：125 °C最低工作温度：-40 °C
最大输出电流：7.5 A封装主体材料：PLASTIC/EPOXY
封装代码：TO-263封装等效代码：SMSIP5H,.6,67TB
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
峰值回流温度（摄氏度）：NOT SPECIFIED认证状态：Not Qualified
座面最大高度：4.8 mm子类别：Switching Regulator or Controllers
表面贴装：YES切换器配置：BUCK-BOOST
最大切换频率：62 kHz技术：BIPOLAR
温度等级：AUTOMOTIVE端子面层：Tin/Lead (Sn/Pb)
端子形式：GULL WING端子节距：1.7 mm
端子位置：SINGLE处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：8.955 mmBase Number Matches：1

LM2576S-12 数据手册

 浏览型号LM2576S-12的Datasheet PDF文件第3页浏览型号LM2576S-12的Datasheet PDF文件第4页浏览型号LM2576S-12的Datasheet PDF文件第5页浏览型号LM2576S-12的Datasheet PDF文件第7页浏览型号LM2576S-12的Datasheet PDF文件第8页浏览型号LM2576S-12的Datasheet PDF文件第9页 
LM2576, LM2576HV  
SNVS107C –JUNE 1999–REVISED APRIL 2013  
www.ti.com  
ELECTRICAL CHARACTERISTICS ALL OUTPUT VOLTAGE VERSIONS  
Specifications with standard type face are for TJ = 25°C, and those with boldface type apply over full Operating Temperature  
Range. Unless otherwise specified, VIN = 12V for the 3.3V, 5V, and Adjustable version, VIN = 25V for the 12V version, and VIN  
= 30V for the 15V version. ILOAD = 500 mA.  
LM2576-XX  
Units  
LM2576HV-XX  
Symbol  
Parameter  
Conditions  
(Limits)  
(1)  
Typ  
Limit  
DEVICE PARAMETERS  
Ib  
Feedback Bias Current  
VOUT = 5V (Adjustable Version Only)  
50  
52  
100/500  
nA  
(2)  
fO  
Oscillator Frequency  
See  
kHz  
47/42  
58/63  
kHz (Min)  
kHz (Max)  
(3)  
VSAT  
DC  
Saturation Voltage  
Max Duty Cycle (ON)  
Current Limit  
IOUT = 3A  
1.4  
98  
V
1.8/2.0  
V(Max)  
(4)  
See  
%
%(Min)  
93  
(3)(2)  
ICL  
See  
5.8  
A
4.2/3.5  
6.9/7.5  
A(Min)  
A(Max)  
IL  
Output Leakage Current  
Quiescent Current  
Output = 0V  
Output = −1V  
Output = −1V  
2
mA(Max)  
mA  
mA(Max)  
7.5  
5
(5)(6)  
30  
(5)  
IQ  
See  
mA  
10  
mA(Max)  
ISTBY  
Standby Quiescent  
Current  
ON /OFF Pin = 5V (OFF)  
50  
μA  
μA(Max)  
200  
(7)  
θJA  
θJA  
θJC  
θJA  
Thermal Resistance  
T Package, Junction to Ambient  
T Package, Junction to Ambient  
T Package, Junction to Case  
S Package, Junction to Ambient  
65  
45  
2
(8)  
°C/W  
(9)  
50  
ON /OFF CONTROL Test Circuit Figure 21 and Figure 22  
VIH  
VIL  
IIH  
ON /OFF Pin  
Logic Input Level  
VOUT = 0V  
1.4  
1.2  
12  
2.2/2.4  
1.0/0.8  
V(Min)  
V(Max)  
VOUT = Nominal Output Voltage  
ON /OFF Pin = 5V (OFF)  
ON /OFF Pin Input  
Current  
μA  
μA(Max)  
30  
10  
IIL  
ON /OFF Pin = 0V (ON)  
0
μA  
μA(Max)  
(1) All limits specified at room temperature (standard type face) and at temperature extremes (bold type face). All room temperature limits  
are 100% production tested. All limits at temperature extremes are specified via correlation using standard Statistical Quality Control  
(SQC) methods.  
(2) The oscillator frequency reduces to approximately 11 kHz in the event of an output short or an overload which causes the regulated  
output voltage to drop approximately 40% from the nominal output voltage. This self protection feature lowers the average power  
dissipation of the IC by lowering the minimum duty cycle from 5% down to approximately 2%.  
(3) Output pin sourcing current. No diode, inductor or capacitor connected to output.  
(4) Feedback pin removed from output and connected to 0V.  
(5) Feedback pin removed from output and connected to +12V for the Adjustable, 3.3V, and 5V versions, and +25V for the 12V and 15V  
versions, to force the output transistor OFF.  
(6) VIN = 40V (60V for high voltage version).  
(7) Junction to ambient thermal resistance (no external heat sink) for the 5 lead TO-220 package mounted vertically, with ½ inch leads in a  
socket, or on a PC board with minimum copper area.  
(8) Junction to ambient thermal resistance (no external heat sink) for the 5 lead TO-220 package mounted vertically, with ¼ inch leads  
soldered to a PC board containing approximately 4 square inches of copper area surrounding the leads.  
(9) If the DDPAK/TO-263 package is used, the thermal resistance can be reduced by increasing the PC board copper area thermally  
connected to the package. Using 0.5 square inches of copper area, θJA is 50°C/W, with 1 square inch of copper area, θJA is 37°C/W,  
and with 1.6 or more square inches of copper area, θJA is 32°C/W.  
6
Submit Documentation Feedback  
Copyright © 1999–2013, Texas Instruments Incorporated  
Product Folder Links: LM2576 LM2576HV  
1...3456789...37

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