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LCS701HG PDF预览

LCS701HG

更新时间: 2024-02-27 06:45:08
品牌 Logo 应用领域
帕沃英蒂格盛 - POWERINT 驱动器接口集成电路高压控制器
页数 文件大小 规格书
26页 2760K
描述
Integrated LLC Controller, High-Voltage Power MOSFETs and Drivers

LCS701HG 技术参数

是否Rohs认证: 符合生命周期:Active
零件包装代码:SIP包装说明:ESIP-16/13
针数:16/13Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.39.00.01
Factory Lead Time:14 weeks风险等级:1.73
高边驱动器:YES接口集成电路类型:HALF BRIDGE BASED MOSFET DRIVER
JESD-30 代码:R-PZIP-T13JESD-609代码:e3
长度:16.51 mm功能数量:1
端子数量:13封装主体材料:PLASTIC/EPOXY
封装代码:SZIP封装形状:RECTANGULAR
封装形式:IN-LINE, SHRINK PITCH峰值回流温度(摄氏度):NOT SPECIFIED
认证状态:Not Qualified最大供电电压:15 V
最小供电电压:11.4 V标称供电电压:12 V
表面贴装:NO端子面层:MATTE TIN
端子形式:THROUGH-HOLE端子节距:0.97 mm
端子位置:ZIG-ZAG处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:2.01 mmBase Number Matches:1

LCS701HG 数据手册

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LCS700-708  
pulse width requirement for detection of both voltage thresholds  
is nominally 30 ns. i.e. the thresholds have to be exceeded for  
>30 ns for proper detection.  
entering the two most sensitive pins on the list, namely the  
FEEDBACK and DT/BF pins, will cause duty cycle, and dead-  
time imbalance, respectively.  
Over-Temperature Shutdown  
Figure 5 and Figure 6 show two alternate schemes for routing  
ground traces for optimum performance. Figure 5 shows a  
layout footprint for the LCS with oval pads. These allow a trace  
to be passed between pins 3 and 5, directly connecting the  
ground systems for the bypass capacitors located on each side  
of the IC.  
The HiperLCS has latching OTP. VCCH must be cycled to  
resume operation once the unit drops down below the OTP  
threshold.  
Basic Layout Guidelines  
The HiperLCS is a high-frequency power device and requires  
careful attention to circuit board layout in order to achieve  
maximum performance.  
Figure 6 shows an LCS layout footprint with round pads that do  
not allow traces to be routed between them due to insufficient  
space. In this case, a jumper (JP1, a 1206 size 0 W resistor) is  
used to connect the ground systems together and allow a  
connection for pin 3 to be routed under JP1 to the optocoupler.  
The bypass capacitors need to be positioned and laid out  
carefully to minimize trace lengths to the pins they serve. SMD  
components are recommended for minimum component and  
trace stray inductance.  
Transformer T1 is a source of both high di/dt signals and dv/dt  
noise. The first can couple magnetically to sensitive circuitry,  
while the second can inject noise via electrostatic coupling.  
Electrostatic noise coupling can be reduced by grounding the  
transformer core, but it is not economically feasible to reduce  
the stray magnetic field around the transformer without drastically  
reducing its efficiency. Sensitive traces and components (such  
as the optocoupler) should be located away from the transformer  
to avoid noise pickup.  
Table 2 describes the recommended bypass capacitor values  
for pins that require filtering/bypassing. The table lists the pins  
in the order of most to least sensitive. The bypass capacitor of  
the pin at the top of the list being the most sensitive, receives  
higher priority in bypass capacitor positioning to minimize trace  
lengths, than the bypass capacitor of the pin below it. Noise  
Pin  
Returned to Pin  
Recommended Value  
Notes  
FEEDBACK (FB)  
GROUND  
4.7 nF (at 250 kHz)  
Increase value proportionally for lower nominal frequency (e.g. 10  
nF at 100 kHz). Forms a pole with FEEDBACK pin input  
impedance which is part of feedback loop characteristic. Must  
not introduce excessive phase shift at expected gain  
crossover frequency. Noise entering FEEDBACK pin will cause  
duty cycle imbalance.  
DEAD-TIME/BURST  
FREQUENCY (DT/BF)  
GROUND  
4.7 nF  
Time constant of this capacitor and the source  
impedance of the resistors connected to DT/BF pin  
must be <100 ms. Noise entering DT/BF pin will cause  
dead time imbalance.  
CURRENT SENSE (IS) GROUND  
1 nF (at 250 kHz)  
Value changes proportionally with nominal LLC stage  
operating frequency. Forms an RC low pass filter with  
recommended 220 W series resistor. Must not attenuate  
AC signal of primary current sense.  
VCC  
GROUND  
1 mF ceramic  
VREF  
GROUND  
HB  
1 mF ceramic  
VCCH  
0.1 mF - 0.47 mF  
Bootstrap capacitor. Provides instantaneous current  
for high-side driver for turning on high-side MOSFET.  
Time constant formed with boost-strap current limiting  
resistor (in series with bootstrap diode), delays VCCH  
UVLO for a few switching cycles at start-up and during  
burst mode operation for the first switching cycles  
DRAIN  
(DC Bus)  
S1, S2  
10-22 nF SMD ceramic  
minimum, plus 22-100 nF  
through-hole  
Total of 22 nF per amp of nominal primary RMS current.  
SMD part must be located directly at the IC and  
connected close, with short traces. This prevents  
ringing of D-S during hard-switching (loss of ZVS)  
transients. It also reduces high-frequency EMI.  
OV/UV  
GROUND  
4.7 nF  
Table 2.  
Bypass Capacitor Table in Order of Importance.  
6
Rev. B 062011  
www.powerint.com  

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