Datasheet > LB4S

LB4S

更新时间： 2024-02-28 19:26:13

品牌	Logo	应用领域
辰达行 - MDD		/
页数	文件大小	规格书
2页	302K
描述
MINIATURE GLASS PASSIVATED SINGLE-PHASE SURFACE MOUNT BRIDGE RECTIFIER

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数据手册

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LB4S 数据手册

LB05S THRU LB10S

MINIATURE GLASS PASSIVATED SINGLE-PHASE SURFACE MOUNT BRIDGE RECTIFIER

REVERSE VOLTAGE: 50 to 1000 VOLTS

FORWARD CURRENT: 0.5 AMPERE

LBXS

FEATURES

· Surge overload rating: 30 amperes peak

· Ideal for printed circuit board

· Plastic material has Underwriters Laboratory

Flammability Classification 94V-0

· Low leakage

· Reliable low cost construction utilizing molded

MECHANICAL DATA

Case: Molded plastic, LBXS

Epoxy: UL 94V-O rate flame retardant

Terminals: Leads solderable per MIL-STD-202,

method 208 guaranteed

Dimensions in inches and (millimeters)

Mounting position: Any

Weight: 0.00528ounce, 0.134gram

Maximum Ratings and Electrical Characteristics

Ratings at 25℃ ambient temperature unless otherwise specified.

Single phase, half wave, 60H_Z, resistive or inductive load.

LB05S

LB1S

100

LB2S

200

140

200

LB4S

400

280

400

LB6S

600

420

600

LB8S

800

560

800

LB10S

1000

700

Units

Volts

V_RRM

V_RMS

V_DC

Maximum Recurrent Peak Reverse Voltage

Maximum RMS Voltage

Maximum DC Blocking Voltage

100

1000

Maximum Average Forward Rectified Current

I_(AV)

Amp

on glass-epoxy P.C.B (Note 2)

on aluminum substrate (Note 3)

0.5

0.8

(see Fig. 1)

Peak Forward Surge Current,

8.3ms single half-sine-wave

I_FSM

superimposed on rated load (JEDEC method)

Maximum Forward Voltage

at 0.4A DC and 25℃

V_F

I_R

Volts

1.0

at T_A=25℃

T_A=125℃

5.0

Maximum Reverse Current

at Rated DC Blocking Voltage

uAmp

500

C_J

R_θJA

Typical Junction Capacitance (Note 1)

Typical Thermal Resistance (Note 3)

Typical Thermal Resistance (Note 2)

Operating and Storage Temperature Range

℃/W

℃

R_θJL

-55 to +150

T_J，Tstg

NOTES:

1- Measured at 1 MH_Zand applied reverse voltage of 4.0 VDC.

2- On glass epoxy P.C.B. mounted on 0.05 x 0.05" (1.3 x 1.3mm) pads

3- On aluminum substrate P.C.B. with an area of 0.8" x 0.8" (20 x 20mm) mounted on 0.05 x 0.05" (1.3 x 1.3mm) solder pad

MDD ELECTRONICS

中文翻译

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