Datasheet > L3-100

L3-100

更新时间： 2022-12-17 09:49:28

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L3-100 数据手册

FERRITE CHIP INDUCTORS

L3 SERIES

9. SOLDERIND AND MOUNTING :

9-1. Recommended PC Board Pattern

ꢂ.60

PC board should be designed so that products are not sufficient

under mechanical stress as warping the board.

0.60

Products shall be positioned in the sideway direction against

the mechanical stress to prevent failure.

9-2. Soldering

ꢁildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused

by the difference in coefficients of expansion between solder% chip and substrate. The terminations are suitable for all

wave and re-flow soldering systems. If hand soldering cannot be avoided% the preferred technique is the utilization of hot

air soldering tools.

9-2.1 Lead Free Solder Re-flow :

Recommended temperature profiles for re-flow soldering in Figure 1.

9-2.2 Solder Wave :

Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature

seen by the circuit when immersed in the molten solder wave% typical at ꢂ30°C. Due to the risk of thermal damage to

products% wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering

is shown in Fig. ꢂ

9-2.3 Soldering Iron (Figure 3) :

Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that

a soldering iron must be employed the following precautions are recommended.

Note :

a) Preheat circuit and products to 150°C.

b) 350°C tip temperature (max)

c) Never contact the ceramic with the iron tip

d) 1.0mm tip diameter (max)

e) Use a ꢂ0 watt soldering iron with tip diameter of 1.0mm

f) Limit soldering time to 3 secs.

Preheating

Soldering

10s max.

Natural

cooling

Preheating

Soldering

Natural

cooling

ꢂ60

ꢂ50 ~ ꢂ60

ꢂ30

ꢂ45

150

180

150

60~1ꢂ0s

30~60s

Gradual

Cooling

Time(sec.)

Figure 1. Re-flow Soldering

Over ꢂmin.

Within 3s

Preheating

Soldering

Natural

cooling

Figure ꢂ. Wave Soldering

(max.)

350

10s

(max.)

330

150

Gradual

Cooling

Over 1min.

Figure 3. Hand Soldering

NOTE : Specifications subject to change without notice. Please check our website for latest information.

01.04.2008

SUPERWORLD ELECTRONICS (S) PTE LTD

PG. 6

1...3 4 567 8 9

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