L
Ultra Low Value
Thin Film Resistors
Vishay Sfernice
ELECTRICAL SPECIFICATIONS
TOLERANCE AND TCR VERSUS OHMIC
VALUE
Resistance range:
Resistance tolerance:
Power dissipation:
0.1 Ω to 10 Ω
1 % to 10 %
0.125 mW to 1 W at + 70 °C
MINIMUM
TOLERANCE
OHMIC
VALUES
BEST TCR
ppm/°C
Temperature coefficient: down to 50 ppm/°C
10 %
0.1 Ω
0.25 Ω
0.5 Ω
1 Ω
300
200
100
100
50
MECHANICAL SPECIFICATIONS
5 %
Substrate:
Alumina
2 %
Resistive layer:
Coating:
NiCr + Ta2O5
Silicone
1 %
1 %
5 Ω
Terminations:
Solderable
B type: SnPb over nickel barrier
N type: SnAg over nickel barrier
G type: gold over nickel barrier
PACKAGING
Several types of packaging are proposed: tube, waffle-pack
and tape and reel.
CLIMATIC SPECIFICATIONS
Operating temp. range:
- 55 °C to + 155 °C
NUMBER OF PIECES PER PACKAGE
TAPE
POWER DERATING CURVE
WAFFLE
PACK
TAPE AND REEL
SIZE
WIDTH
TUBE
MIN.
MAX.
2" x 2"
100
80
60
40
20
0
0505
0603
500
100
0805
0705
100
100
4000
2000
8 mm
1005
1206
1505
2010
140
00
250
100
12 mm
0
20
40
60 70 80
100
120
140 155
Ambient Temperature in °C
PERFORMANCE
VALUES AND DRIFT
TESTS
CONDITIONS
MIL-R-55342
TYPICAL
REQUIREMENTS
PERFORMANCES
MIL-R-55342 C
MIL-STD-702-Method 107
Thermal shock
0.25 %
0.10 %
0.25 %
0.25 %
0.02 %
MIL-R-55342 C
PARA 3.10.4.7.5
Short time overload
0.01 %
0.01 %
0.04 %
MIL-R-55342 C
PARA 3.9 and 4.7.4
Low temperature operation
Resistance to solder heat
MIL-R-55342 C
PARA 3.12, 4.7.7, 4.7.1.2
MIL-R-55342 C
PARA 3.13 and 4.7.8
MIL-STD-202-Method 106
Moisture resistance
High temperature
Load life
0.40 %
0.20 %
0.50 %
0.01 %
0.075 %
0.15 %
MIL-R-55342 C
PARA 3.11 and 4.7.6
MIL-R-55342 C
2000 h Pn at 70 °C
MIL-STD-202-Method 108
www.vishay.com
58
For technical questions, contact: sfer@vishay.com
Document Number: 53018
Revision: 12-Dec-07