Datasheet > L0805H1R20JNT

L0805H1R20JNT

更新时间： 2024-01-07 23:42:39

品牌	Logo	应用领域
威世 - VISHAY		电阻器
页数	文件大小	规格书
5页	136K
描述
RESISTOR, THIN FILM, 0.2 W, 5 %, 50 ppm, 1.2 ohm, SURFACE MOUNT, 0805, CHIP, GREEN

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技术参数
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L0805H1R20JNT 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	包装说明：	, 0805
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8533.21.00.30	风险等级：	5.74
JESD-609代码：	e2	安装特点：	SURFACE MOUNT
端子数量：	2	最高工作温度：	155 °C
最低工作温度：	-55 °C	封装形状：	RECTANGULAR PACKAGE
包装方法：	TR	额定功率耗散 (P)：	0.2 W
额定温度：	70 °C	电阻：	1.2 Ω
电阻器类型：	FIXED RESISTOR	尺寸代码：	0805
子类别：	Fixed Resistors	表面贴装：	YES
技术：	THIN FILM	温度系数：	50 ppm/ °C
端子面层：	Tin/Silver (Sn/Ag) - with Nickel (Ni) barrier	端子形状：	WRAPAROUND
容差：	5%	工作电压：	50 V
Base Number Matches：	1

L0805H1R20JNT 数据手册

SMD Wraparound Ultra Low Value

Thin Film Resistors

Vishay Sfernice

PACKAGING

PACKAGING RULES

Several types of packaging are proposed: waffle-pack and

tape and reel

Waffle Pack

Can be filled up to maximum quantity indicated in the table

here above, taking into account the minimum order quantity.

When quantity ordered exceeds maximum quantity of a

single waffle pack, the waffle packs are stacked up on the top

of each other and closed by one single cover.

To get “not stacked up” waffle pack in case of ordered

quantity > maximum number of pieces per package:

Please concult Vishay/Sfernice for specific ordering

code

NUMBER OF PIECES PER PACKAGE

TAPE

SIZE MOQ

TAPE AND REEL

WAFFLE PACK

WIDTH

2" × 2"

MIN.

MAX.

4000

2000

0402

0603

0805

100

8 mm

0705

Tape and Reel

100

Can be filled up to maximum quantity indicated in the table

here above, taking into account the minimum order quantity.

When quantity ordered is between the MOQ and the

maximum reel capacity, only one reel is provided.

When several reels are needed for ordered quantity

within MOQ and maximum reel capacity: Please consult

Vishay Sfernice for specific ordering code

1206

1505

2010

140

8 mm ⁽¹⁾

Note

⁽¹⁾12 mm on request

•

Size 2512 under development

PERFORMANCE

VALUES AND DRIFT

TESTS

CONDITIONS

MIL-R-55342

TYPICAL

REQUIREMENTS

PERFORMANCES

MIL-R-55342 C

MIL-STD-702-Method 107

Thermal shock

0.25 %

0.10 %

0.25 %

0.02 %

0.01 %

0.04 %

MIL-R-55342 C

PARA 3.10.4.7.5

Short time overload

MIL-R-55342 C

PARA 3.9 and 4.7.4

Low temperature operation

Resistance to solder heat

MIL-R-55342 C

PARA 3.12, 4.7.7, 4.7.1.2

MIL-R-55342 C

PARA 3.13 and 4.7.8

MIL-STD-202-Method 106

Moisture resistance

High temperature

Load life

0.40 %

0.20 %

0.50 %

0.01 %

0.075 %

0.15 %

MIL-R-55342 C

PARA 3.11 and 4.7.6

MIL-R-55342 C

2000 h Pn at 70 °C

MIL-STD-202-Method 108

Document Number: 53018

Revision: 29-Oct-09

For technical questions, contact: sfer@vishay.com

www.vishay.com

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