®
Accu-L 0805
Application Notes
HANDLING
PREHEAT & SOLDERING
SMD chips should be handled with care to avoid damage or
contamination from perspiration and skin oils. The use of
plastic tipped tweezers or vacuum pick-ups is strongly
recommended for individual components. Bulk handling
should ensure that abrasion and mechanical shock are min-
imized. For automatic equipment, taped and reeled product
is the ideal medium for direct presentation to the placement
machine.
The rate of preheat in production should not exceed
4°C/second. It is recommended not to exceed 2°C/
second.
Temperature differential from preheat to soldering should not
exceed 150°C.
For further specific application or process advice, please
consult AVX.
HAND SOLDERING & REWORK
CIRCUIT BOARD TYPE
Hand soldering is permissible. Preheat of the PCB to 100°C
is required. The most preferable technique is to use hot air
soldering tools. Where a soldering iron is used, a tempera-
ture controlled model not exceeding 30 watts should be
used and set to not more than 260°C. Maximum allowed
time at temperature is 1 minute. When hand soldering, the
base side (white side) must be soldered to the board.
All flexible types of circuit boards may be used (e.g. FR-4,
G-10) and also alumina.
2
For other circuit board materials, please consult factory.
COMPONENT PAD DESIGN
Component pads must be designed to achieve good joints
and minimize component movement during soldering.
COOLING
Pad designs are given below for both wave and reflow
soldering.
After soldering, the assembly should preferably be allowed to
cool naturally. In the event of assisted cooling, similar condi-
tions to those recommended for preheating should be used.
The basis of these designs is:
a. Pad width equal to component width. It is permissible
to decrease this to as low as 85ꢀ of component width
but it is not advisable to go below this.
CLEANING RECOMMENDATIONS
b. Pad overlap about 0.3mm.
Care should be taken to ensure that the devices are thor-
oughly cleaned of flux residues, especially the space beneath
the device. Such residues may otherwise become conduc-
tive and effectively offer a lossy bypass to the device. Various
recommended cleaning conditions (which must be optimized
for the flux system being used) are as follows:
c. Pad extension about 0.3mm for reflow.
Pad extension about 0.8mm for wave soldering.
WAVE SOLDERING
DIMENSIONS: millimeters (inches)
Cleaning liquids . . . . . . i-propanol, ethanol, acetylace-
tone, water, and other standard
PCB cleaning liquids.
1.3±
1.2
(±.±514
(±.±074
Ultrasonic conditions . . power – 20w/liter max.
frequency – 20kHz to 45kHz.
3.1
(±.1224
±.5±
(±.±2±4
1.0
3.8
Temperature. . . . . . . . . 80°C maximum (if not otherwise
limited by chosen solvent system).
(±.±554
(±.15±4
1.3±
(±.±514
Time. . . . . . . . . . . . . . . 5 minutes max.
1.2
0603
Accu-L
0805
Accu-L
(±.±074
±.8
(±.±314
®
®
1.5
(±.±594
STORAGE CONDITIONS
®
Recommended storage conditions for Accu-L prior to use
are as follows:
REFLOW SOLDERING
DIMENSIONS: millimeters (inches)
Temperature. . . . . . . . . 15°C to 35°C
Humidity . . . . . . . . . . . ≤65ꢀ
Air Pressure . . . . . . . . . 860mbar to 1060mbar
±.7
±.9±
(±.±284
(±.±354
2.3
(±.±914
±.5±
(±.±2±4
2.8
1.0
(±.11±4 (±.±554
±.9±
(±.±354
0603
Accu-L
0805
Accu-L
RECOMMENDED SOLDERING
PROFILE
±.7
(±.±284
®
®
±.8
(±.±314
1.5
(±.±594
For recommended soldering profile see page 23
3±
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