是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | FBGA, BGA88,8X12,32 | Reach Compliance Code: | compliant |
风险等级: | 5.8 | 最长访问时间: | 70 ns |
启动块: | BOTTOM | 命令用户界面: | YES |
通用闪存接口: | YES | 数据轮询: | YES |
JESD-30 代码: | R-PBGA-B88 | 内存密度: | 67108864 bit |
内存集成电路类型: | FLASH | 内存宽度: | 16 |
部门数/规模: | 8,127 | 端子数量: | 88 |
字数: | 4194304 words | 字数代码: | 4000000 |
最高工作温度: | 70 °C | 最低工作温度: | |
组织: | 4MX16 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | FBGA | 封装等效代码: | BGA88,8X12,32 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, FINE PITCH |
页面大小: | 8 words | 并行/串行: | PARALLEL |
电源: | 1.8 V | 认证状态: | Not Qualified |
部门规模: | 4K,32K | 最大待机电流: | 0.00005 A |
子类别: | Flash Memories | 最大压摆率: | 0.07 mA |
标称供电电压 (Vsup): | 1.8 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | 切换位: | YES |
类型: | NOR TYPE | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
K8A6415EBC-DC7B0 | SAMSUNG |
获取价格 |
Flash, 4MX16, 70ns, PBGA88, 8 X 11 MM, 1.10 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-88 |
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K8A6415EBC-DC7BT | SAMSUNG |
获取价格 |
Flash, 4MX16, 70ns, PBGA88, |
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K8A6415EBC-DC7C | SAMSUNG |
获取价格 |
Flash, 4MX16, 70ns, PBGA88, |
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K8A6415EBC-DC7D | SAMSUNG |
获取价格 |
Flash, 4MX16, 70ns, PBGA88, |
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K8A6415EBC-DC7E | SAMSUNG |
获取价格 |
Flash, 4MX16, 70ns, PBGA88, |
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K8A6415EBC-DE7D | SAMSUNG |
获取价格 |
Flash, 4MX16, 70ns, PBGA88, |
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K8A6415EBC-DE7E | SAMSUNG |
获取价格 |
Flash, 4MX16, 70ns, PBGA88, |
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K8A6415EBC-FC7B | SAMSUNG |
获取价格 |
Flash, 4MX16, 70ns, PBGA88, |
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K8A6415EBC-FC7B0 | SAMSUNG |
获取价格 |
Flash, 4MX16, 70ns, PBGA88, 8 X 11 MM, 1.10 MM HEIGHT, 0.80 MM PITCH, FBGA-88 |
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K8A6415EBC-FC7D0 | SAMSUNG |
获取价格 |
Flash, 4MX16, 70ns, PBGA88, 8 X 11 MM, 1.10 MM HEIGHT, 0.80 MM PITCH, FBGA-88 |
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