Datasheet > K1050SD1

K1050SD1

更新时间： 2023-12-06 19:52:30

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K1050SD1 数据手册

KxxxxSD1 Series

JieJie Microelectronics Co., Ltd.

ORDERING INFORMATION

MARKING

K09S: Device Marking Code

K09S

SOLDERING PARAMETERS

Pb-Free assembly

(see FIG.2)

Reflow Condition

-Temperature Min (T_s(min)

-Temperature Max(T_s(max)

-Time (Min to Max) (ts)

)

+150℃

Pre Heat

)

+200℃

60-180 secs.

3℃/sec. Max

+217℃

Average ramp up rate (Liquidus Temp (T_L) to peak)

T_s(max)to T_L- Ramp-up Rate

-Temperature(T_L) (Liquidus)

Reflow

-Temperature(t_L)

60-150 secs.

+260(+0/-5)℃

30 secs. Max

6℃/sec. Max

8 min. Max

+260℃

Peak Temp (T_p)

Time within 5℃of actual Peak Temp (t_p)

Ramp-down Rate

Time 25℃to Peak Temp (T_P)

Do not exceed

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