JEB03SCDS‐A for ESD Protection
SOLDERING PARAMETERS
Reflow Condition
JieJie Microelectronics CO. , Ltd
Pb-Free assembly
(see figure at right)
-Temperature Min (Ts(min)
-Temperature Max(Ts(max)
-Time (Min to Max) (ts)
)
+150℃
Reflow condition
tp
Pre
)
+200℃
Heat
TP
Critical Zone
Ramp-up
TL to TP
60-180 secs.
TL
tL
Average ramp up rate (Liquidus Temp
(TL)to peak)
TS(max)
3℃/sec. Max
Ramp-down
Preheat
ts
Ts(max) to TL - Ramp-up Rate
3℃/sec. Max
+217℃
TS(min)
-Temperature(TL)(Liquidus)
Reflow
25
time to peak temperatue
Time
(t 25℃ to peak)
-Temperature(tL)
60-150 secs.
+260(+0/-5)℃
Peak Temp (Tp)
Time within 5℃of actual Peak Temp (tp) 20-40secs.
Ramp-down Rate
6℃/sec. Max
8 min. Max
+260℃
Time 25℃ to Peak Temp (TP)
Do not exceed
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