INCH-POUND
MIL-PRF-19500/578M
24 June 2013
SUPERSEDING
MIL-PRF-19500/578L
19 October 2010
The documentation and process conversion measures
necessary to comply with this document shall be
completed by 24 September 2013.
PERFORMANCE SPECIFICATION SHEET
SEMICONDUCTOR DEVICE, DIODE, SILICON, SWITCHING, 1N6638, 1N6642, 1N6643,
1N6638U, 1N6642U, 1N6643U, 1N6638US, 1N6642US, 1N6643US, 1N6642UB, 1N6642UB2,
1N6642UB2R, 1N6642UBCA, 1N6642UBD, 1N6642UBCC, JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC
The JANS1N4148-1 is no longer qualified and is superseded by JANS1N6642. See 6.4.
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product described herein
shall consist of this specification sheet and MIL-PRF-19500.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for switching diodes. Four levels of product
assurance are provided for each device type as specified in MIL-PRF-19500.
* 1.2 Physical dimensions. See figures 1 (DO-35), 2 (U, US), 3 (UB), 4 (UB2), 5, and 6.
1.3 Maximum ratings. Unless otherwise specified TA = +25°C.
V
V
I
I
R
R
R
R
T
BR
RWM O(PCB)
FSM
t =
p
θJL
θJEC
θJA(PCB)
θJSP
STG
& T
L =
L = 0
(1)
(2)
(1) (3)
T =75°
J
A
Types
.375 inch
(9.53 mm)
(1) (2)
1/120 s
(1) (2)
V (pk) V (pk)
mA
300
300
300
300
A (pk)
2.5
°C/W
150
°C/W
40
°C/W
250
250
250
250
°C/W
°C
1N6638
150
150
100
100
125
125
75
-65 to +175
-65 to +175
-65 to +175
-65 to +175
1N6638U, 1N6638US
1N6642
2.5
2.5
150
150
1N6642U, 1N6642US
75
2.5
40
1N6642UB, 1N6642UB2,
1N6642UB2R, 1N6642UBCA,
1N6642UBD, 1N6642UBCC
100
75
300
2.5
325
100
-65 to +200
1N6643
75
75
50
50
300
300
2.5
2.5
250
250
-65 to +175
-65 to +175
1N6643U, 1N6643US
40
* (1) For temperature-current derating curves, see figures 7 and 8.
* (2) See figures 9, 10, 11, and 13 for thermal impedance curves. T = +75°C for both axial and Metal Electrode
A
Leadless Face diodes (MELF) (U, US) on printed circuit board (PCB), PCB = FR4 - .0625 inch (1.59 mm)
1-layer 1-Oz Cu, horizontal, in still air; pads for U, US = .061 inch (1.55 mm) x .105 inch (2.67 mm); pads for axial
= .092 inch (2.34 mm) diameter, strip = .030 inch (0.76 mm) x 1 inch (25.4 mm) long, lead length L ≤ .187 inch
(≤ 4.75 mm); R
with a defined PCB thermal resistance condition included, is measured at I = 300 mA dc.
θJA
O
(3)
R
θJSP
refers to thermal resistance from junction to the solder pads of the UB package.
Comments, suggestions, or questions on this document should be addressed to DLA Land and Maritime,
ATTN: VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to Semiconductor@.dla.mil. Since
contact information can change, you may want to verify the currency of this address information using the
ASSIST Online database at https://assist.dla.mil .
AMSC N/A
FSC 5961
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