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ISL6545, ISL6545A
Absolute Maximum Ratings
Thermal Information
Supply Voltage, V
. . . . . . . . . . . . . . . . . . . . . GND - 0.3V to 15V
Thermal Resistance
θ
(°C/W)
θ (°C/W)
JC
CC
JA
BOOT Voltage, V
. . . . . . . . . . . . . . . . . . . . GND - 0.3V to 36V
BOOT
SOIC Package (Note 1) . . . . . . . . . . . .
DFN Package (Note 3). . . . . . . . . . . . .
Maximum Junction Temperature
(Plastic Package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Maximum Storage Temperature Range. . . . . . . . . -65°C to +150°C
Maximum Lead Temperature
95
44
N/A
5.5
UGATE Voltage V
. . . . . . . . V
- 0.3V to V
GND - 0.3V to V
+ 0.3V
+ 0.3V
+ 0.3V
UGATE
LGATE/OCSET Voltage, V
PHASE
BOOT
LGATE/OCSET
. . . . . . . . . .GND - 0.3V to V
CC
PHASE Voltage, V
PHASE
Upper Driver Supply Voltage, V
BOOT
- V
. . . . . . . . . . . . .15V
BOOT
. . . . . . . . . . . . . . . . . . . . . . . . . . .24V
PHASE
Clamp Voltage, V
- V
BOOT
CC
FB, COMP/SD Voltage. . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to 6V
ESD Classification, HBM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5kV
ESD Classification, MM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .150V
ESD Classification, CDM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0kV
(Soldering 10s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +300°C
(SOIC - Lead Tips Only)
Operating Conditions
Supply Voltage, V
. . . . +5V ±10%, +12V ±20%, or 6.5V to 14.4V
CC
Ambient Temperature Range
ISL6545C, ISL6545AC. . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
ISL6545I, ISL6545AI . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
Junction Temperature Range. . . . . . . . . . . . . . . . . .-40°C to +125°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. θ is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
JA
2. θ is measured with the component mounted on a high effective thermal conductivity test board in free air, with “direct attach” features. See
JA
Tech Brief TB379 for details.
3. For θ , the “case temp” location is the center of the exposed metal pad on the package underside.
JC
4. Guaranteed by design; not production tested
Electrical Specifications Test Conditions: V = 12V, T = 0 to 85°C, Unless Otherwise Noted.
CC
J
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
V
SUPPLY CURRENT
CC
Input Bias Supply Current
I
V
= 12V; disabled
CC
4
5.2
7
mA
VCC
POWER-ON RESET
Rising V
POR Threshold
V
3.9
4.1
4.3
V
V
CC
POR
V
POR Threshold Hysteresis
0.30
0.35
0.40
CC
OSCILLATOR
Switching Frequency
f
f
ISL6545C
ISL6545I
270
240
540
510
300
300
600
600
1.5
330
330
660
660
kHz
kHz
kHz
kHz
OSC
OSC
ISL6545AC
ISL6545AI
Ramp Amplitude (Note 4)
REFERENCE
ΔV
V
P-P
OSC
Reference Voltage Tolerance
ISL6545C
ISL6545I
-1.0
-1.5
-
-
+1.0
+1.5
%
%
V
Nominal Reference Voltage
ERROR AMPLIFIER
V
0.600
REF
DC Gain (Note 4)
GAIN
GBWP
SR
-
-
-
96
20
9
-
-
-
dB
Gain-Bandwidth Product (Note 4)
Slew Rate (Note 4)
MHz
V/μs
GATE DRIVERS
Upper Gate Source Impedance
Upper Gate Sink Impedance
Lower Gate Source Impedance
R
R
V
V
V
= 14.5V; I = 50mA
= 14.5V; I = 50mA
= 14.5V; I = 50mA
-
-
-
3.0
2.7
2.4
-
-
-
Ω
Ω
Ω
UG-SRCh
CC
CC
CC
UG-SNKh
R
LG-SRCh
FN6305.3
November 15, 2006
4